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0.5 Oz Green Solder Mask FR4 TG170 Multilayer PCB Board

0.5 Oz Green Solder Mask FR4 TG170 Multilayer PCB Board

0.5 Oz Green Solder Mask FR4 TG170 Multilayer PCB Board
0.5 Oz Green Solder Mask FR4 TG170 Multilayer PCB Board
0.5 Oz Green Solder Mask FR4 TG170 Multilayer PCB Board
Product Details:
Place of Origin: China
Brand Name: ACCPCB
Certification: ISO, UL, SGS,TS16949
Model Number: S120712
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: Negotiable
Packaging Details: Vacuum packing with desiccant
Delivery Time: 10-12days
Payment Terms: L/C / T/T / Western Union / Paypal
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Detailed Product Description
Product Name: Multilayer Rigid Boards Thickness: 1.0mm
Size: 150mmX100mm Min. Line Spacing: 0.1MM / 4MIL
Board Thickness: 0.5~3.2mm Surface Finishing: HAL LEAD FREE, Immersion Gold,immersion Silver /TIN
Copper Thickness: 0.5oz-6oz Min Line Spacing: 4mil (0.1mm)
Min.line Width: 4 Mil ( 0.1mm) Min Drill Hole Size: 0.2mm
High Light:

TG170 Multilayer PCB Board


FR4 Multilayer PCB Board


FR4 0.5 Oz Green PCB

0.5 Oz Green Solder Mask FR4 TG170 Multilayer PCB Board

FR4 TG170 Material Multilayer PCB board green soldermask for amplifier pcb board


Production description :

this board is 6layer with 4oz copper thickness. it is used on amplifier. PCB prototype,samll volum, middle and large volume are accepted. no MOQ request for new boards.


Key Specifications of amplifier PCB board:

Production Types: Rigid PCB
Layer : Multilayer 
Base Material : FR4 tg170
Copper Thickness : 4 oz
Board Thickness : 1.0mm
Min. Finish Hole Size : 8 mil (0.10mm)
Min. Line Width : 4 mil
Min. Line Spacing : 4 mil
Surface Finishing : ENIG,OSP,HASL,Immersion Gold,Gold Plating
Drilling hole tolerance: +/-3 mil ( 0.075mm )
Min Outline tolerance : +/-4 mil ( 0.10mm )
Working panel size : max:1200mmX600mm (47'' X24'')
Outline profile: Punching, Routing , CNC routing + V-cut
Solder mask : LPI Solder mask, Peelable mask
Solder Mask Color : Blue, black,yellow, matte green
Certificate : UL, CQC, TS16949, ISO14000, ROHS
Silkscreen color : White
Twist and Bow : no more than 0.75 %


PCB Flow Chart.pdf


Products Application:

Our products are widely used in meter, medical, solar energy, mobile, communication, industrial control, power electronics,security, consuming, computer, automotive, aerospace, military and so on.


Advantages :
• Strict product liability, taking IPC-A-160 standard
• Engineering pretreatment before production
• Production process control (5Ms)
• 100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
• 100% AOI inspection, including X-ray, 3D microscope and ICT
• High-voltage test, impedance control test
• Micro section, soldering capacity, thermal stress test, shocking test
• In-house PCB production
• No minimum order quantity and free sample
• Focus on low to medium volume production
• Quick and on-time delivery


Technical Capability:

 ITEMS Capability
 Max. layer count 28L
 Min. line widty 0.08mm
Min. line spacing 0.08mm
 Min. hole size 0.15mm
 Board thickness 0.4-6.0mm
Max. boardsize 520×620mm
(PTH) Hole size tolerance(PTH) ±0.075mm
(NPTH) Hole size tolerance(NPTH) ) ±0.05mm
Holeposition tolerance(Routing) ±0.1mm
 Outline tolerance(Punching) ±0.1mm


0.5 Oz Green Solder Mask FR4 TG170 Multilayer PCB Board 0



1. What kinds of boards can ACCPCB process?

    Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.

2. What data are needed for PCB production?

    PCB Gerber files with RS-274-X format.

4. What’s the typical process flow for multi-layer PCB?

    Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating →      Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T →      Visual Inspection.

5. How many types of surface finish ACCPCB can do?

     the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.


6. How do ACCPCB ensure quality?

Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process




Contact Details
Accuracy Electronics Technologies Co.,Ltd

Contact Person: sales

Tel: +8615889494185

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