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12 Layer FR4 Tg170 1.5oz copper thickness Prototype PCB Board and Immersion Gold

12 Layer FR4 Tg170 1.5oz copper thickness Prototype PCB Board and Immersion Gold

12 Layer FR4 Tg170 1.5oz copper thickness Prototype PCB Board and Immersion Gold
12 Layer FR4 Tg170 1.5oz copper thickness Prototype PCB Board and Immersion Gold
12 Layer FR4 Tg170 1.5oz copper thickness Prototype PCB Board and Immersion Gold
Product Details:
Place of Origin: China
Brand Name: ACCPCB
Certification: ISO,SGS,TS16949
Model Number: S10691
Payment & Shipping Terms:
Minimum Order Quantity: 1 PCS
Price: Negotiable
Packaging Details: Vacuum packing
Delivery Time: 3-5days
Payment Terms: T/T ,Western Union,Paypal
Supply Ability: 50000SQ.M/Per Month
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Detailed Product Description
Material: FR41g170 Count: 12 Layer
Surface Finish: Immersion Gold Usage: Electronics Equipment
Solder Mask: Green Copper Thickness: 1.5oz All Layer
Board Thickness: 1.6mm Min. Hole Size: 0.1mm
Min. Line Spacing: 4mil Min. Line Width: 4mil
Surface Finishing: ENIG
High Light:

tg170 Prototype PCB Board

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1.5oz FR4 Prototype PCB Board

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12 Layer Tg170 Prototype PCB

12 Layer FR4 Tg170 1.5oz copper thickness Prototype PCB Board and Immersion Gold

 

Production description :

 

this board is 12 layer pcb. it is used on electronic control . we can accep PCB prototype,samll volum, middle and large volume. no MOQ request for new boards, for repeat order, just meet 3sq.m.

 

Key Specifications/Special Features:

 

Number of layers:

12 layer

Base material:

FR4tg170

Copper thickness:

1.5 oz Cu in all layer

Thickness:

1.58 mm

Size:

160 x 200 mm

Cooper In holes:

min 20um

Surface finishing:

immersion gold

Solder mask:

LPI,peelable mask

Solder mask:

Green

Working panel size :

max:1200mmX600mm (47'' X24'')

Outline profile:

Punching, Routing , CNC routing + V-cut

Certificate :

UL, CQC, TS16949, ISO14000, ROHS

Twist and Bow :

no more than 0.75 %

Solder mask :

LPI Solder mask, Peelable mask

Min Line width/space:

0.10mm/0.10mm

Base Copper thickness:

0.5oz-6oz

Aspect ratio:

10:1(max)

  

PCB Flow Chart.pdf

 

Products Application:

 

Our products are widely used in meter, medical, solar energy, mobile, communication, industrial control, power electronics,security, consuming, computer, automotive, aerospace, military and so on. Over 75% of our products are exported to Europe, North America, Japan and other Asia Pacific countries.

 

12 Layer FR4 Tg170 1.5oz copper thickness Prototype PCB Board and Immersion Gold 0

Technology Capability:

 

Item

Technical Parameters

Layers

1-28 Layers

Inner Layer Min Trace/Space

4/4 mil

Out Layer Min Trace,Space

4/4 mil

Inner Layer Max Copper

4 OZ

Out Layer Max Copper

4 OZ

Inner Layer Min Copper

1/3 oz

Out Layer Min Copper

1/3 oz

Min hole size

0.15 mm

Max.board thickness

6 mm

Min.board thickness

0.2mm

Max.board size

680*1200 mm

PTH Tolerance

+/-0.075mm

NPTH Tolerance

+/-0.05mm

Countersink Tolerance

+/-0.15mm

Board Thickness Tolerance

+/-10%

Min BGA

7mil

Min SMT

7*10 mil

Solder mask bridge

4 mil

Solder mask color

White,black,blue,green,yellow,red,etc

Legend color

White,black,yellow,gray,etc

Surface finish

HAL,OSP, Immersion Ni/Au ,Imm silver/SN,ENIG

Board materials

FR-4;high TG;HighCTI; halogen free; Aluminum Bsed PCB,high frequency(rogers,isola),copper -base PCB

Impedance control

+/-10%

Bow and twist

≤0.5

 

  • 12 Layer FR4 Tg170 1.5oz copper thickness Prototype PCB Board and Immersion Gold 1

 

 

FAQ

 

1. How do ACCPCB ensure quality?

 

Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?

 

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


3. What data are needed for PCB production?

 

PCB Gerber files with RS-274-X format.


4. What’s the typical process flow for multi-layer PCB?

 

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


5. How many types of surface finish ACCPCB can do?

 

O-the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.


6. What are the main factors which will affect the price of PCB?

 

Material;
Surface finish;

Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;

 

7. How to you make the impedance calculation?

 

The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment.

Contact Details
Accuracy Electronics Technologies Co.,Ltd

Contact Person: sales

Tel: +8615889494185

Send your inquiry directly to us (0 / 3000)