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12 Layer High Current PCB Immersion Gold Green Solder Mask For Wireless Charger

12 Layer High Current PCB Immersion Gold Green Solder Mask For Wireless Charger

  • 12 Layer High Current PCB Immersion Gold Green Solder Mask For Wireless Charger
  • 12 Layer High Current PCB Immersion Gold Green Solder Mask For Wireless Charger
12 Layer High Current PCB Immersion Gold Green Solder Mask For Wireless Charger
Product Details:
Place of Origin: China
Brand Name: ACCPCB
Certification: ISO, UL, SGS,TS16949
Model Number: P1009
Payment & Shipping Terms:
Minimum Order Quantity: 20PCS
Price: Negotiable
Packaging Details: Vacuum packing with desiccant
Delivery Time: 8-15 Days
Payment Terms: L/C / D/A / T/T / Western Union
Supply Ability: 30,000SQ.M/PER MONTH
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Detailed Product Description
Material: FR4 TG170 Thickness: 1.20mm
Number Of Layers: 12 Layer Min. Line Spacing: 0.1mm4mil)
Silkscreen Color: White/black/yellow/red/blue Surface Finishing: ENIG
High Light:

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,

lcd display pcb

12 Layer High Current PCB Immersion Gold Green Solder Mask For Wireless Charger

 

 

Key Specifications/Special Features :

 

Layer : 12 Layers
Base Material : KB FR4 TG170
Board Thickness : 1.60mm
Min. Hole Size : 6mil / 0.15mm
Min. Line Width : 4/4 mil
Min. Line Spacing : 4/4mil
Surface Finishing : Lead Free HAL
Solder Mask Color : Green
Certificate : UL, CQC, TS16949, ISO14000, ROHS
Silkscreen color : White
Outline : Routing + V-CUT

 

Quality assurance :

  • Every production process has a special person to test to ensure quality, AOI and E-testing.
  • Have professional engineers to check the quality
  • All products have passed CE, FCC, ROHS and other certifications

Application:

 

Industril Control System
Power Supply
LED drive, LED Lighting
Communication Device
automotive electronics
Security Electronics
Household Control
Digital Appliances
Frequency converter
Medical Device

 

Shipping Information:


FOB Port : Hong Kong / Shenzhen                                     Lead Time : 8 - 15 days
HTS Code : 8534.00.10                                    Dimensions per Carton : 37X27X22mm
Weight Per Carton : 20 Kilograms

 

FAQ :

 

1. How do ACCPCB ensure quality?

 

Our high quality standard is achieved with the following.

 

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?

 

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


3. What data are needed for PCB production?

 

PCB Gerber files with RS-274-X format.


4. What’s the typical process flow for multi-layer PCB?

 

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


5. How many types of surface finish ACCPCB can do?

 

O-the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.


6. What are the main factors which will affect the price of PCB?

 

Material;
Surface finish;

Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;

 

7. How to you make the impedance calculation?

 

The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment.

  

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Contact Details
Accuracy Electronics Technologies Co.,Ltd

Contact Person: sales

Tel: +8615889494185

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