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12 Layer Immersion Gold 1.8mm FR4 TG170 High Density PCB

12 Layer Immersion Gold 1.8mm FR4 TG170 High Density PCB

12 Layer Immersion Gold 1.8mm FR4 TG170 High Density PCB
12 Layer Immersion Gold 1.8mm FR4 TG170 High Density PCB
12 Layer Immersion Gold 1.8mm FR4 TG170 High Density PCB
Product Details:
Place of Origin: China
Brand Name: ACCPCB
Certification: ISO,SGS,TS16949
Model Number: S10213
Payment & Shipping Terms:
Minimum Order Quantity: 1 PCS
Price: Negotiable
Packaging Details: Vacuum packing
Delivery Time: 3-5days
Payment Terms: T/T ,Western Union,Paypal
Supply Ability: 50000SQ.M/Per Month
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Detailed Product Description
Material: FR4 Tg170 Count: 12 Layer
Surface Finish: Immersion Gold Application: Smart Home Device
Solder Mask: Blue,Green,black, Yellow Etc. Copper Thickness: 2oz All Layer
Min. Hole Size: 8 Mil/6 Mil Min. Line Spacing: 4mil
Min. Line Width: 4mil Service: Customized PCB
High Light:

TG170 High Density PCB

,

FR4 TG170 PCB

,

Immersion Gold 1.8mm PCB

12 Layer Immersion Gold 1.8mm FR4 TG170 High Density PCB

1.8mm thickness FR4 TG170 High Density PCB with Immersion gold for Smart home device

 

Production description :

this board is 12layer with 2oz copper thickness. it is used on smart home device. we can accept PCB prototype,samll volum, middle and large volume. no MOQ request for new order. all of these boards are met UL,TS16949, ISO9001 Etc.

 

Key Specifications of high frequency board :

Production Types:

 Rigid PCB

Layer :

 12 layer

Base Material :

 FR4  tg170

Copper Thickness :

2 oz

Board Thickness :

 0.4mm

Min. Finish Hole Size :

 8 mil  (0.20mm)

Min. Line Width :

 4 mil

Min. Line Spacing :

 4 mil

Surface Finishing :

ENIG,OSP,HASL,Immersion Gold,Gold Plating

Drilling hole tolerance:

+/-3 mil    (  0.075mm )

Min Outline tolerance :

+/-4 mil    (  0.10mm )

Working panel size :

 max:1200mmX600mm (47'' X24'')

Outline profile:

Punching, Routing , CNC routing + V-cut

Solder mask :

LPI Solder mask, Peelable mask

Solder Mask Color :

Blue, black,yellow, matte green

Certificate :

UL, CQC, TS16949, ISO14000, ROHS

Silkscreen color :

White

Twist and Bow :

 no more than 0.75 %

PCB Flow Chart.pdf

 

Products Application:

1, Security monitor: Moible phone, PDA, GPS, caramer monitor etc;

2, Telecom Communication :wireless LAN card, XDSL router,Servers, Optical Device,Hard Drive etc;

3, Consumer Electronics: TV, DVD,Digital Caramer, air conditoner, Refrigerator,set-top box etc;

4, Vehicle Electronices: Car etc;

5, Industrial controls: Medical device ,UPS equipment, Control device etc;

6, Military & Defense : Military Weapons etc;

 

12 Layer Immersion Gold 1.8mm FR4 TG170 High Density PCB 0

 

Technology Capability:

Item Technical Parameters
Layers 1-28 Layers
Inner Layer Min Trace/Space 4/4 mil
Out Layer Min Trace,Space 4/4 mil
Inner Layer Max Copper 4 OZ
Out Layer Max Copper 4 OZ
Inner Layer Min Copper 1/3 oz
Out Layer Min Copper 1/3 oz
Min hole size 0.15 mm
Max.board thickness 6 mm
Min.board thickness 0.2mm
Max.board size 680*1200 mm
PTH Tolerance +/-0.075mm
NPTH Tolerance +/-0.05mm
Countersink Tolerance +/-0.15mm
Board Thickness Tolerance +/-10%
Min BGA 7mil
Min SMT 7*10 mil
Solder mask bridge 4 mil
Solder mask color White,black,blue,green,yellow,red,etc
Legend color White,black,yellow,gray,etc
Surface finish HAL,OSP, Immersion Ni/Au ,Imm silver/SN,ENIG
Board materials FR-4;high TG;HighCTI; halogen free; Aluminum Bsed PCB,high frequency(rogers,isola),copper -base PCB
Impedance control +/-10%
Bow and twist ≤0.5

12 Layer Immersion Gold 1.8mm FR4 TG170 High Density PCB 1

FAQ :

1. How do ACCPCB ensure quality?

   Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?

  Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


3. What data are needed for PCB production?

    PCB Gerber files with RS-274-X format.


4. What’s the typical process flow for multi-layer PCB?

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


5. How many types of surface finish ACCPCB can do?

   the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.


6. What are the main factors which will affect the price of PCB?

Material;
Surface finish;

Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;

 

 

Contact Details
Accuracy Electronics Technologies Co.,Ltd

Contact Person: sales

Tel: +8615889494185

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