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1.0 Oz Lead Free PCB

1.0 Oz Lead Free PCB

  • 1.0 Oz Lead Free PCB
  • 1.0 Oz Lead Free PCB
1.0 Oz Lead Free PCB
Product Details:
Place of Origin: China
Brand Name: ACCPCB
Certification: ISO, UL, SGS,TS16949
Model Number: P11032
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: Negotiable
Packaging Details: Vacuum packing with desiccant
Delivery Time: 10days
Payment Terms: L/C / D/P / T/T / Western Union / Paypal
Supply Ability: 30,000SQ.M/Month
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Detailed Product Description
Thickness: 1.50mm Surface Finish: Immersion Gold
Size: 90mmX180mm Color: Green Solder Mask
Service: OEM Services Provided Testing: 100% E-Testing,100% AOI

10layer Lead Free PCB AOI Inspection 1.0 Oz Copper Thickness and size 100mmX180mm



Production Feature:


Layer : 10 Layers
Base Material : FR4 Tg130
Copper Thickness : 1.0oz in all layer
Board Thickness : 1.50 mm
Surface Finish : Immersion gold
Min. Hole Size : 6 mil, 0.15mm
Min. Line Width : 4/4 mil, 0.10/0.10 mm
Min. Line Spacing : 4/4mil, 0.10/0.10mm
Application : electronic device
Certification : ISO9001, UL, ROHS,TS16949




Advantages :

▪ No MOQ, 14 years of PCB turnkey services
▪ Quick turn, prototype, low & medium & high volume
▪ OEM services provide
▪ ISO 9001-, ISO 14001-, ISO/TS16949, ISO 13485, IATF16949, OHSAS18001 certified
▪ 100% E-test, visual, AOI inspection, including X-ray, 3D microscope
▪ Fast response within 24 hours




1. How do ACCPCB ensure quality?


Our high quality standard is achieved with the following.


1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?


Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.

3. What data are needed for PCB production?


PCB Gerber files with RS-274-X format.

4. What’s the typical process flow for multi-layer PCB?


Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.

5. How many types of surface finish ACCPCB can do?


O-the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.

6. What are the main factors which will affect the price of PCB?


Surface finish;

Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;


7. How to you make the impedance calculation?


The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment.



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Contact Details
Accuracy Electronics Technologies Co.,Ltd

Contact Person: sales

Tel: +8615889494185

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