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1.2mm 8 Layer FR4 Impedance PCB Board for Digital Caramer

1.2mm 8 Layer FR4 Impedance PCB Board for Digital Caramer

  • 1.2mm 8 Layer FR4 Impedance PCB Board for Digital Caramer
  • 1.2mm 8 Layer FR4 Impedance PCB Board for Digital Caramer
1.2mm 8 Layer FR4 Impedance PCB Board for Digital Caramer
Product Details:
Place of Origin: China
Brand Name: ACCPCB
Certification: ISO, UL, SGS,TS16949
Model Number: M1-003A22
Payment & Shipping Terms:
Minimum Order Quantity: 1 pcs
Price: Negotiable
Packaging Details: Vacuum packing with desiccant
Delivery Time: 5-8DAS
Payment Terms: L/C / T/T / Western Union / Paypal
Supply Ability: 30000SQ.M/PER MONTH
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Detailed Product Description
Product Name: Impedance Control PCB Board Thickness: 1.20mm
Cooper Thickness: 1oz Function: Digital Caramer
Base Material: Fr4 Min. Hole Size: 0.20 Mm
Min. Line Width: 0.1 0mm Min. Line Spacing: 0.1mm
Mim Drill Hole Size: 0.20mm
High Light:

FR4 Impedance PCB Board


FR4 8 Layer PCB


TS16949 Impedance PCB

Digital Caramer 1.2mm 8 Layer FR4 Impedance PCB Board


8layer FR4 Impedance control PCB 1.2mm thickness for digital caramer


Production description :

this board is 8 layer it is used for digital caramer.  PCB prototype,samll volum, middle and large volume is accepted. no MOQ request for new order.all of our PCB are met UL, TS 16949,ROHS, ISO etc. certification.


PCB Flow Chart.pdf


Key Specifications/Special Features of aluminum boards:

Base material : aluminum base
Copper thickness : 1oz
Board thickness : 0.8mm
Min. hole size : 0.35mm
Min. line width : 6mils
Min. line spacing : 6mils
Surface finishing : HAL LEAD FREE
Standard : IPC-A-610G
Soldermask color : white
Board thickness tolerance : ±10%
Twist& wrap : ≤ 0.5%
Certificate : RoHS, ISO 9001, UL


Products Application:

Our products are widely used in consumer electronics products,network, computer peripheral products,optoelectronic products,power supply products, electronic components,electrical mechanical products and so on.


Technology Capability:

Item Technical Parameters
Layers 1-28 Layers
Inner Layer Min Trace/Space 4/4 mil
Out Layer Min Trace,Space 4/4 mil
Inner Layer Max Copper 4 OZ
Out Layer Max Copper 4 OZ
Inner Layer Min Copper 1/3 oz
Out Layer Min Copper 1/3 oz
Min hole size 0.15 mm
Max.board thickness 6 mm
Min.board thickness 0.2mm
Max.board size 680*1200 mm
PTH Tolerance +/-0.075mm
NPTH Tolerance +/-0.05mm
Countersink Tolerance +/-0.15mm
Board Thickness Tolerance +/-10%
Min BGA 7mil
Min SMT 7*10 mil
Solder mask bridge 4 mil
Solder mask color White,black,blue,green,yellow,red,etc
Legend color White,black,yellow,gray,etc
Surface finish HAL,OSP, Immersion Ni/Au ,Imm silver/SN,ENIG
Board materials FR-4;high TG;HighCTI; halogen free; Aluminum Bsed PCB,high frequency(rogers,isola),copper -base PCB
Impedance control +/-10%
Bow and twist ≤0.5



1.2mm 8 Layer FR4 Impedance PCB Board for Digital Caramer 0



1. How do ACCPCB ensure quality?

   Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?

   Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.

3. What data are needed for PCB production?

    PCB Gerber files with RS-274-X format.

4. What’s the typical process flow for multi-layer PCB?

    Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.

5. How many types of surface finish ACCPCB can do?

   the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.


6. How to you make the impedance calculation?

   The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment.


Any further question, welcome to contact us by sending your inquiries


Contact Details
Accuracy Electronics Technologies Co.,Ltd

Contact Person: sales

Tel: +8615889494185

Send your inquiry directly to us (0 / 3000)