|Place of Origin:||China|
|Certification:||ISO, UL, SGS,TS16949|
|Minimum Order Quantity:||1PCS|
|Packaging Details:||Vacuum packing with desiccant|
|Payment Terms:||L/C / D/P / T/T / Western Union / Paypal|
|Surface Finish:||ROHS HAL LEAD FREE||Size:||80mmX160mm|
|Color:||Black Solder Mask||Board Thickness:||1.6mm-3.2mm|
|Min. Line Spacing:||0.1mm4mil)||Copper Thickness:||35um|
enig rohs pcb,
monitor circuit board
1.80mm thickness Lead Free PCB , High Tg PCB High Voltage Black Solder Mask for Battery Charger
|Base Material :||FR4|
|Copper Thickness :||1 / 1 / 1/ 1 oz in all layer|
|Board Thickness :||1.80 mm|
|Min. Hole Size :||8mil, 0.2mm|
|Min. Line Width :||5 / 5 mil, 0.127 / 0.127 mm|
|Min. Line Spacing :||5 / 5 mil, 0.127 / 0.127 mm|
|Application :||digital Video|
|Certification :||ISO9001, UL, ROHS,TS16949|
Quality assurance :
Every production process has a special person to test to ensure quality
Have professional engineers to check the quality
All products have passed CE, FCC, ROHS and other certifications
▪ No MOQ, 14 years of PCB turnkey services
▪ Quick turn, prototype, low & medium & high volume
▪ OEM services provide
▪ ISO 9001-, ISO 14001-, ISO/TS16949, ISO 13485, IATF16949, OHSAS18001 certified
▪ 100% E-test, visual, AOI inspection, including X-ray, 3D microscope
▪ Fast response within 24 hours
1. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process
2. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
3. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
4. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.
5. How many types of surface finish ACCPCB can do?
the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.
Contact Person: sales