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3 Oz Immersion Gold 8 Layer Fr4 Tg170 HDI PCB Board OEM service

3 Oz Immersion Gold 8 Layer Fr4 Tg170 HDI PCB Board OEM service

3 Oz Immersion Gold 8 Layer Fr4 Tg170 HDI PCB Board OEM service
3 Oz Immersion Gold 8 Layer Fr4 Tg170 HDI PCB Board OEM service
3 Oz Immersion Gold 8 Layer Fr4 Tg170 HDI PCB Board OEM service
Product Details:
Place of Origin: China
Brand Name: ACCPCB
Certification: ISO,SGS,TS16949
Model Number: S10214
Payment & Shipping Terms:
Minimum Order Quantity: 1 PCS
Price: Negotiable
Packaging Details: Vacuum packing
Delivery Time: 3-5days
Payment Terms: T/T ,Western Union,Paypal
Supply Ability: 50000SQ.M/Per Month
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Detailed Product Description
Material: KB FR4tg170 Count: 8 Layer
Surface Finish: Immersion Gold Application: Wireless Electronics
Solder Mask: Blue,Green,black, Yellow Etc. Copper Thickness: 3 Oz All Layer
Min. Hole Size: 8 Mil/6 Mil Min. Line Spacing: 4mil
Min. Line Width: 4mil Service: Customized PCB
High Light:

Tg170 HDI PCB Board

,

Fr4 HDI PCB Board

,

8 Layer Immersion Gold PCB

3 Oz Immersion Gold 8 Layer Fr4 Tg170 HDI PCB Board OEM Service

8 layer fr4 tg170 HDI PCB Board with immersion gold for wireless production

 

Production description :

It is HDI board. black solder mask board and immersion gold surface. it has blinded and buried vias.PCB prototype,samll volum, middle and large volume are accepted. no MOQ request for new boards. All PCB are passed UL, TS16949, ROHS ,ISO9001 etc. Certification.

 

Key Specifications of tablet PCB board​ :

Production Types:

 Rigid PCB

Layer :

 8 layer

Base Material :

 FR4 

Copper Thickness :

 3oz

Board Thickness :

 0.4mm

Min. Finish Hole Size :

 8 mil  (0.20mm)

Min. Line Width :

 4 mil

Min. Line Spacing :

 4 mil

Surface Finishing :

ENIG,OSP,HASL,Immersion Gold,Gold Plating

Drilling hole tolerance:

+/-3 mil    (  0.075mm )

Min Outline tolerance :

+/-4 mil    (  0.10mm )

Working panel size :

 max:1200mmX600mm (47'' X24'')

Outline profile:

Punching, Routing , CNC routing + V-cut

Solder mask :

LPI Solder mask, Peelable mask

Solder Mask Color :

Blue, black,yellow, matte green

Certificate :

UL, CQC, TS16949, ISO14000, ROHS

Silkscreen color :

White

Twist and Bow :

 no more than 0.75 %

 

PCB Flow Chart.pdf

 

Products Application:

Our products are widely used in meter, medical, solar energy, mobile, communication, industrial control, power electronics,security, consuming, computer, automotive, aerospace, military and so on

 

3 Oz Immersion Gold 8 Layer Fr4 Tg170 HDI PCB Board OEM service 0

Technology Capability:

Items Technical Capability
Layers 1-28 layers Min. line width/space 4mil

Max.board size (single&doule

sided)

600*1200mm Min.annular ring width: vias 3mil
Surface finish

HAL lead free,gold flash

Immersion silver,Immersion gold ,Immersion Sn,

hard gold,OSP,ect

Min.board thickness(multilayer) 4layers:0.4mm;
6layers:0.6mm;
8layers:1.0mm;
10layers:1.20mm
Board materials

FR-4; high Tg; high CTI; halogen free; high frequency(rogers,taconic,

PTFE,nelcon,

ISOLA,polyclad 370 HR); heavy copper,

Metal base clade laminate

Plating thickness (Technique:

Immersion Ni/Au)

Plating type: Imm Ni, Min./Max thickness:100/150U'' Plating type: Imm Au, Min./Max thickness:2/4U''
Impedance control ± 10%

Distance between

line to board edge

Outline: 0.2mm

V-CUT: 0.4mm

Base copper thickness(Inner

and outer layer)

Min. thickness: 0.5 OZ Max.thickness: 6OZ Min.hole size(board thickness ≥2mm) Aspect ratio≤16
Finished copper thickness Outer layers:
Min.thickness 1 OZ,
Max.thickness 10 OZ
Inner layers:
Min.thickness :0.5OZ,
Max.thickness : 6 OZ
Max.board thickness(single&doule sided) 3.20mm

 


3 Oz Immersion Gold 8 Layer Fr4 Tg170 HDI PCB Board OEM service 1  

FAQ :

1. How do ACCPCB ensure quality?

  Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?

  Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


3. What data are needed for PCB production?

     PCB Gerber files with RS-274-X format.


4. What’s the typical process flow for multi-layer PCB?

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


5. How many types of surface finish ACCPCB can do?

   the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.


 

Contact Details
Accuracy Electronics Technologies Co.,Ltd

Contact Person: sales

Tel: +8615889494185

Send your inquiry directly to us (0 / 3000)