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6 mil 3 Layer Immersion Gold Multi Layer Circuit Board For UPS Device

6 mil 3 Layer Immersion Gold Multi Layer Circuit Board For UPS Device

6 mil 3 Layer Immersion Gold Multi Layer Circuit Board For UPS Device
6 mil 3 Layer Immersion Gold Multi Layer Circuit Board For UPS Device
6 mil 3 Layer Immersion Gold Multi Layer Circuit Board For UPS Device
Product Details:
Place of Origin: China
Brand Name: ACCPCB
Certification: ISO,SGS,TS16949
Model Number: S1021342
Payment & Shipping Terms:
Minimum Order Quantity: 1 PCS
Price: Negotiable
Packaging Details: Vacuum packing
Delivery Time: 3-5days
Payment Terms: T/T ,Western Union,Paypal
Supply Ability: 50000SQ.M/Per Month
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Detailed Product Description
Material: KB FR4 Count: 3layer
Surface Finish: Immersion Gold Application: UPS Device
Solder Mask: Green Copper Thickness: 3oz All Layer
Min. Hole Size: 8 Mil/6 Mil Min. Line Spacing: 4mil
Min. Line Width: 4mil Service: Customized PCB
High Light:

Immersion Gold Multi Layer Circuit Board

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3oz Multi Layer Circuit Board

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6 mil Multi Layer Circuit Board

6 mil 3 Layer Immersion Gold Multi Layer Circuit Board For UPS Device

 

Production description :

 

this board is 3 layer with 3 oz copper thickness. it is used for UPS device. PCB prototype,samll volum, middle and large volume are accepted. no MOQ request for new order. all of these boards are met UL,TS16949, ISO9001 Etc.

 

PCB Flow Chart.pdf

 

Key Specifications of high frequency board :

 

Production Types:

 Multilayer board

Layer :

3layer

Base Material :

FR4  

Copper Thickness :

3oz

Board Thickness :

 1.4mm

Min. Finish Hole Size :

 8 mil  (0.20mm)

Min. Line Width :

 4 mil

Min. Line Spacing :

 4 mil

Surface Finishing :

 Immersion gold

Drilling hole tolerance:

+/-3 mil    (  0.075mm )

Min Outline tolerance :

+/-4 mil    (  0.10mm )

Working panel size :

 max:1200mmX600mm (47'' X24'')

Outline profile:

Punching, Routing , CNC routing + V-cut

Solder mask :

LPI Solder mask, Peelable mask

Solder Mask Color :

Blue, black,yellow, matte green

Certificate :

UL, CQC, TS16949, ISO14000, ROHS

Silkscreen color :

White

Twist and Bow :

 no more than 0.75 %

 

ACCPCB Technical Capability.pdf

 

Products Application:

 

1, Security monitor: Moible phone, PDA, GPS, caramer monitor etc;

 

2, Telecom Communication :wireless LAN card, XDSL router,Servers, Optical Device,Hard Drive etc;

 

3, Consumer Electronics: TV, DVD,Digital Caramer, air conditoner, Refrigerator,set-top box etc;

 

4, Vehicle Electronices: Car etc;

 

5, Industrial controls: Medical device ,UPS equipment, Control device etc;

 

6, Military & Defense : Military Weapons etc;

 

 

 

Technology Capability:

 

Item

Technical Parameters

Layers

1-28 Layers

Inner Layer Min Trace/Space

4/4 mil

Out Layer Min Trace,Space

4/4 mil

Inner Layer Max Copper

4 OZ

Out Layer Max Copper

4 OZ

Inner Layer Min Copper

1/3 oz

Out Layer Min Copper

1/3 oz

Min hole size

0.15 mm

Max.board thickness

6 mm

Min.board thickness

0.2mm

Max.board size

680*1200 mm

PTH Tolerance

+/-0.075mm

NPTH Tolerance

+/-0.05mm

Countersink Tolerance

+/-0.15mm

Board Thickness Tolerance

+/-10%

Min BGA

7mil

Min SMT

7*10 mil

Solder mask bridge

4 mil

Solder mask color

White,black,blue,green,yellow,red,etc

Legend color

White,black,yellow,gray,etc

Surface finish

HAL,OSP, Immersion Ni/Au ,Imm silver/SN,ENIG

Board materials

FR-4;high TG;HighCTI; halogen free; Aluminum Bsed PCB,high frequency(rogers,isola),copper -base PCB

Impedance control

+/-10%

Bow and twist

≤0.5
 

 

6 mil 3 Layer Immersion Gold Multi Layer Circuit Board For UPS Device 0

FAQ :

 

 

1. What’s the typical process flow for multi-layer PCB?

 

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.

 

2. What kinds of boards can ACCPCB process?

 

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.

 

3. How do ACCPCB ensure quality?

 

Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4 Dedicated quality assurance team with failure case analysis process

 

4. How many types of surface finish ACCPCB can do?

 

O-the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.

 


5. What data are needed for PCB production?

 

PCB Gerber files with RS-274-X format.

Contact Details
Accuracy Electronics Technologies Co.,Ltd

Contact Person: sales

Tel: +8615889494185

Send your inquiry directly to us (0 / 3000)