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Black Solder Mask ITEQ FR4 PWB Circuit Board For Wireless Lan Card

Black Solder Mask ITEQ FR4 PWB Circuit Board For Wireless Lan Card

Black Solder Mask ITEQ FR4 PWB Circuit Board For Wireless Lan Card
Black Solder Mask ITEQ FR4 PWB Circuit Board For Wireless Lan Card
Black Solder Mask ITEQ FR4 PWB Circuit Board For Wireless Lan Card
Product Details:
Place of Origin: China
Brand Name: ACCPCB
Certification: ISO,SGS,TS16949
Model Number: S10212
Payment & Shipping Terms:
Minimum Order Quantity: 1 PCS
Price: Negotiable
Packaging Details: Vacuum packing
Delivery Time: 3-5days
Payment Terms: T/T ,Western Union,Paypal
Supply Ability: 50000SQ.M/Per Month
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Detailed Product Description
Material: ITEQ FR4 Count: 10 Layer
Surface Finish: Immersion Tin Application: Wireless Lan Card
Solder Mask: Green,black, Yellow Etc. Copper Thickness: 1oz All Layer
Min. Hole Size: 8 Mil/6 Mil Min. Line Spacing: 4mil
Min. Line Width: 4mil Service: Customize
High Light:

ITEQ FR4 PWB Circuit Board


8mil PCB Circuit Board



Black Solder Mask ITEQ FR4 PWB Circuit Board For Wireless Lan Card


Production description :


this board is black soldermask pcb and  used on wireless lan card . we can accep PCB prototype,samll volum, middle and large volume. no MOQ request for new boards, for repeat order, just meet 3sq.m.


Key Specifications of single PCB board :


Production Types:

Rigid PCB

Layer :

10 Layer

Base Material :


Copper Thickness :

 1 oz

Board Thickness :


Min. Finish Hole Size :

 8 mil  (0.10mm)

Min. Line Width :

 4 mil

Min. Line Spacing :

 4 mil

Surface Finishing :

ENIG,OSP,HASL,Immersion Gold,Gold Plating

Drilling hole tolerance:

+/-3 mil    (  0.075mm )

Min Outline tolerance :

+/-4 mil    (  0.10mm )

Working panel size :

 max:1200mmX600mm (47'' X24'')

Outline profile:

Punching, Routing , CNC routing + V-cut

Solder mask :

LPI Solder mask, Peelable mask

Solder Mask Color :

Blue, black,yellow, matte green

Certificate :

UL, CQC, TS16949, ISO14000, ROHS

Silkscreen color :


Twist and Bow :

 no more than 0.75 %


PCB Flow Chart.pdf



Products Application:


1, Consumer Electronics: TV, DVD,Digital Caramer, air conditoner, Refrigerator,set-top box etc;


2, Security monitor: Moible phone, PDA, GPS, caramer monitor etc;


3, Telecom Communication :wireless LAN card, XDSL router,Servers, Optical Device,Hard Drive etc;


4, Industrial controls: Medical device ,UPS equipment, Control device etc;


5, Vehicle Electronices: Car etc;


6, Military & Defense : Military Weapons etc;



Technology Capability:



Technical Parameters


1-28 Layers

Inner Layer Min Trace/Space

4/4 mil

Out Layer Min Trace,Space

4/4 mil

Inner Layer Max Copper

4 OZ

Out Layer Max Copper

4 OZ

Inner Layer Min Copper

1/3 oz

Out Layer Min Copper

1/3 oz

Min hole size

0.15 mm

Max.board thickness

6 mm

Min.board thickness


Max.board size

680*1200 mm

PTH Tolerance


NPTH Tolerance


Countersink Tolerance


Board Thickness Tolerance





7*10 mil

Solder mask bridge

4 mil

Solder mask color


Legend color


Surface finish

HAL,OSP, Immersion Ni/Au ,Imm silver/SN,ENIG

Board materials

FR-4;high TG;HighCTI; halogen free; Aluminum Bsed PCB,high frequency(rogers,isola),copper -base PCB

Impedance control


Bow and twist



Black Solder Mask ITEQ FR4 PWB Circuit Board For Wireless Lan Card 0



1. How do ACCPCB ensure quality?


Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?


Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.

3. What data are needed for PCB production?


PCB Gerber files with RS-274-X format.

4. What’s the typical process flow for multi-layer PCB?


Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.

5. How many types of surface finish ACCPCB can do?


O-the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.

6. What are the main factors which will affect the price of PCB?


Surface finish;

Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;


7. How do you make the impedance calculation?


The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment.

Contact Details
Accuracy Electronics Technologies Co.,Ltd

Contact Person: sales

Tel: +8615889494185

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