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Black Solder Mask OEM ODM Multilayer Printed Circuit Board ENIG Surface

Black Solder Mask OEM ODM Multilayer Printed Circuit Board ENIG Surface

Black Solder Mask OEM ODM Multilayer Printed Circuit Board ENIG Surface
Black Solder Mask OEM ODM Multilayer Printed Circuit Board ENIG Surface
Black Solder Mask OEM ODM Multilayer Printed Circuit Board ENIG Surface
Product Details:
Place of Origin: China
Brand Name: ACCPCB
Certification: ISO, UL, SGS,TS16949
Model Number: P12045
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: Negotiable
Packaging Details: Vacuum packing with desiccant
Delivery Time: 10days
Payment Terms: L/C / D/P / T/T / Western Union / Paypal
Supply Ability: 30,000SQ.M/Month
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Detailed Product Description
Material: KB FR4 Fiber Glass Thickness: 2.3mm
Surface Finish: Lead Free HAL Application: Printer
Size: 100mmX1250mm Color: Black Solder Mask
Min. Line Spacing: 0.1mm/4mil Min. Hole Size: 0.10mm
Type: Customized Service: EMS.ODM.OEM
High Light:

ODM Multilayer Printed Circuit Board

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OEM Multilayer Printed Circuit Board

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ENIG Surface Multilayer Printed Circuit Board

Black Solder Mask OEM ODM Multilayer Printed Circuit Board ENIG Surface

 

PCB Flow Chart.pdf

 

 

Production Feature:

 

Layer : 12 Layers
Base Material : FR4
Copper Thickness : 2 oz in all layer
Board Thickness : 1.8mm
Min. Hole Size : 6 mil / 0.15mm
Min. Line Width : 4/4 mil , 0.075/0.075 mm
Min. Line Spacing : 4/4mil, 0.075/0.075 mm
Surface Finish : immesion gold
Certification : ISO9001, UL, ROHS,TS16949
Application : Industrial printer
Min.Line width/space: 0.10mm / 0.10mm
Min. annular rign width : 0.05mm
Outline profile: Punching,Routing,
Twist and bow : 0.5-0.75%
Impedance control: +/-10%

 

 

 

Advantages :


▪ No MOQ, 14 years of PCB turnkey services
▪ Quick turn, prototype, low & medium & high volume
▪ OEM services provide
▪ ISO 9001-, ISO 14001-, ISO/TS16949, ISO 13485, IATF16949, OHSAS18001 certified
▪ 100% E-test, visual, AOI inspection, including X-ray, 3D microscope
▪ Fast response within 24 hours

 

 

FAQ :

 

1. How do ACCPCB ensure quality?

 

Our high quality standard is achieved with the following.

 

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?

 

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


3. What data are needed for PCB production?

 

PCB Gerber files with RS-274-X format.


4. What’s the typical process flow for multi-layer PCB?

 

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


5. How many types of surface finish ACCPCB can do?

 

O-the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.


 

 

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Contact Details
Accuracy Electronics Technologies Co.,Ltd

Contact Person: sales

Tel: +8615889494185

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