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Blind Buried Hdi PCB 2.0 board thickness 2oz copper thickness and Immersion Silver

Blind Buried Hdi PCB 2.0 board thickness 2oz copper thickness and Immersion Silver

Blind Buried Hdi PCB 2.0 board thickness  2oz copper thickness and Immersion Silver
Blind Buried Hdi PCB 2.0 board thickness  2oz copper thickness and Immersion Silver
Blind Buried Hdi PCB 2.0 board thickness  2oz copper thickness and Immersion Silver
Product Details:
Place of Origin: China
Brand Name: ACCPCB
Certification: ISO, UL, SGS,TS16949
Model Number: P1211
Payment & Shipping Terms:
Minimum Order Quantity: 1 PCS
Price: Negotiable
Packaging Details: Vacuum packing with desiccant
Delivery Time: 12-15Days
Payment Terms: L/C / T/T / Western Union / Paypal
Supply Ability: 30000SQ.M/PER MONTH
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Detailed Product Description
Number Of Layer: 8 L Material: ShengyiFR4
Finish Copper Thickness: 1 OZ Inner Layer / 2 Oz Outlayer Surface Finish: Immersion Silver
PTH Tolerance: -/+3mil Min Holes: 6mil
High Light:

electronic pcb board


hdi pcb prototype

Blind Buried Hdi PCB 2.0 board thickness 2oz copper thickness and Immersion Silver
Production Features :

Layer : 8layer 
Base Material : Shengyi FR4
Copper Thickness : 2oz outlayer / 1 oz inner layer
Board Thickness : 2.0 mm
Min. Hole Size : 6mil, 0.16mm
Min. Line Width : 0.15 / 0.15 mm
Min. Line Spacing : 0.15 / 0.15 mm
Surface Finishing : immersion silver
Solder Mask Color : Green
Certificate : UL, CQC, TS16949, ISO14000, ROHS
PTH tolerance : +/-3mil
NPTH tolerance : +/-2mil
Silkscreen color : White
Outline : Routing,V-Groove


PCB Flow Chart.pdf


Rigid PCB Technical Capability:

Items Technical Capability
Layers 1-28 layers Min. line width/space 4mil

Max.board size (single&doule


600*1200mm Min.annular ring width: vias 3mil
Surface finish

HAL lead free,gold flash

Immersion silver,Immersion gold ,Immersion Sn,

hard gold,OSP,ect

Min.board thickness(multilayer) 4layers:0.4mm;
Board materials

FR-4; high Tg; high CTI; halogen free; high frequency(rogers,taconic,


ISOLA,polyclad 370 HR); heavy copper,

Metal base clade laminate

Plating thickness (Technique:

Immersion Ni/Au)

Plating type: Imm Ni, Min./Max thickness:100/150U'' Plating type: Imm Au, Min./Max thickness:2/4U''
Impedance control ± 10%

Distance between

line to board edge

Outline: 0.2mm

V-CUT: 0.4mm

Base copper thickness(Inner

and outer layer)

Min. thickness: 0.5 OZ Max.thickness: 6OZ Min.hole size(board thickness ≥2mm) Aspect ratio≤16
Finished copper thickness Outer layers:
Min.thickness 1 OZ,
Max.thickness 10 OZ
Inner layers:
Min.thickness :0.5OZ,
Max.thickness : 6 OZ
Max.board thickness(single&doule sided) 3.20mm


Company description : 
ACCPCB is a high-tech enterprise specializing in the production and sales of double-sided and multi-layer rigid circuit boards in Boluo County, Huizhou City. It has an independent property factory of about 20,000 square meters, more than 500 employees, and an annual design production capacity of 500,000 square meters. The company has passed ISO9001 and ISO14000 quality and environmental system certification, and has obtained UL certification of the United States. The process capability is comprehensive and the technical strength is strong. The products fully comply with the EU RoHS directive green environmental protection requirements. The company aims to become a first-class professional circuit board manufacturer, providing the highest quality products and services based on quality assurance, we listen to the voice of our customers, establish a good relationship with all customers, and make progress together and grow together.
• Strict product liability, taking IPC-A-160 standard
• Engineering pretreatment before production
• Production process control (5Ms)
• 100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
• 100% AOI inspection, including X-ray, 3D microscope and ICT
• High-voltage test, impedance control test
• Micro section, soldering capacity, thermal stress test, shocking test
• In-house PCB production
• No minimum order quantity and free sample
• Focus on low to medium volume production
• Quick and on-time delivery

Shipping Information:
FOB Port : Hong Kong                                                          Lead Time : 8 - 20 days
HTS Code : 8534.00.90                                                   Dimensions per Carton : 37X27X22mm
Weight Per Carton : 20 Kilograms

1. What kinds of boards can ACCPCB process?
   Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.

2. What data are needed for PCB production?
    PCB Gerber files with RS-274-X format.

3. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.

4. How many types of surface finish ACCPCB can do?
O-the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.

5. What are the main factors which will affect the price of PCB?
Surface finish;
Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;

6. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

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Contact Details
Accuracy Electronics Technologies Co.,Ltd

Contact Person: sales

Tel: +8615889494185

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