|Place of Origin:||China|
|Certification:||ISO, UL, SGS,TS16949|
|Minimum Order Quantity:||1-5PCS|
|Packaging Details:||Vacuum packaging|
|Payment Terms:||L/C / T/T / Western Union / Paypal|
|Supply Ability:||30,000SQ.M/PER MONTH|
|Min Holes Size:||3mil With Blinded & Buried Holes||Surface Finish:||OSP|
|Thickness:||2.4mm||Solder Mask:||Matte Green|
double sided fr4 pcb,
dual layer pcb
Blue Peelable Glue Impedance Control PCB Green Solder Mask For 5G Equipment
Key Specifications/Special Features :
|Base Material :||ITEQFR4|
|Board Thickness :||2.4mm|
|Layers :||10 layers|
|Copper thickness :||1 / 1 / 1 / 1 / 1 / 1 / 1 / 1 OZ|
|Surface Finish :||HAL +Blue Peelable glue|
|Min. Hole Size :||0.150mm|
|Min. Line Width :||0.1mm/4mil|
|Min. Line Spacing :||4/4mil(0.1/0.1mm)|
|Company type:||Manufacturer/ Factory|
|Certificate:||UL, CQC, TS16949, ISO14000, ROHS|
Quality assurance :
Every production process has a special person to test to ensure quality, AOI, E-testing, Flying Probe Test.
Have professional engineers to check the quality
All products have passed CE, FCC, ROHS and other certifications
Widely used in stage, Industrila control,computer,consuming electronics,security,automotive,power electronics,medical,telecom etc.
Lead Time :
|Lead Time||2 /L||4 /L||6/ L||8/ L|
1. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process
2. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
3. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
4. How many types of surface finish ACCPCB can do?
the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.
5. What are the main factors which will affect the price of PCB?
Board thickness, Copper thickness;
Different quality criteria;
Contact Person: sales