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Edge Plating Multilayer PCB Board under UL, CQC, TS16949, ISO14000, ROHS certification

Edge Plating Multilayer PCB Board under UL, CQC, TS16949, ISO14000, ROHS certification

    • Edge Plating Multilayer PCB Board under UL, CQC, TS16949, ISO14000, ROHS certification
    • Edge Plating Multilayer PCB Board under UL, CQC, TS16949, ISO14000, ROHS certification
  • Edge Plating Multilayer PCB Board under UL, CQC, TS16949, ISO14000, ROHS certification

    Product Details:

    Place of Origin: China
    Brand Name: ACCPCB
    Certification: ISO, UL, SGS,TS16949
    Model Number: S10-0022B

    Payment & Shipping Terms:

    Minimum Order Quantity: 1PCS
    Price: Negotiable
    Packaging Details: Vacuum packing with desiccant
    Delivery Time: 10-12days
    Payment Terms: L/C / T/T / Western Union / Paypal
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    Detailed Product Description
    Count: 4 Layer Copper Thickness: 1oz
    Cooper In Holes: 20um Application: Electronics Device
    Pcb Standard: IPC-A-610 E Class II-III Item: FR4 Rigid Board
    High Light:

    multilayer printed circuit board

    ,

    fr4 double sided pcb

     

    Edge Plating Multilayer PCB Board under UL, CQC, TS16949, ISO14000, ROHS certification

     

    Key Specifications/Special Features:

     

    Count : 4 Layers
    Base Material : FR4
    Copper Thickness : 1 oz inner layer / 1oz outlayer
    Board Thickness : 1.20 mm
    Cooper in holes : min 20um
    Min. Hole Size : 8mil / 0.2mm
    Min. Line Width : 4 / 4 mil
    Min. Line Spacing : 4 / 4 mil
    Surface Finishing : ENIG (AU:2U'')
    Certificate: UL, CQC, TS16949, ISO14000, ROHS

     

    Advantages :


    • Strict product liability, taking IPC-A-160 standard
    • Engineering pretreatment before production
    • Production process control (5Ms)
    • 100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
    • 100% AOI inspection, including X-ray, 3D microscope and ICT
    • High-voltage test, impedance control test
    • Micro section, soldering capacity, thermal stress test, shocking test
    • In-house PCB production
    • No minimum order quantity and free sample
    • Focus on low to medium volume production
    • Quick and on-time delivery

     

     

    Technical Capability:

     

     ITEMS Capability
     Max. layer count 28L
     Min. line widty 0.08mm
    Min. line spacing 0.08mm
     Min. hole size 0.15mm
     Board thickness 0.4-6.0mm
    Max. boardsize 520×620mm
    (PTH) Hole size tolerance(PTH) ±0.075mm
    (NPTH) Hole size tolerance(NPTH) ) ±0.05mm
    Holeposition tolerance(Routing) ±0.1mm
     Outline tolerance(Punching) ±0.1mm

     

    FAQ :

     

    1. How do ACCPCB ensure quality?

     

    Our high quality standard is achieved with the following.

     

    1.1 The process is strictly controlled under ISO 9001:2008 standards.
    1.2 Extensive use of software in managing the production process
    1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
    1.4.Dedicated quality assurance team with failure case analysis process

    2. What kinds of boards can ACCPCB process?

     

    Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


    3. What data are needed for PCB production?

     

    PCB Gerber files with RS-274-X format.


    4. What’s the typical process flow for multi-layer PCB?

     

    Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


    5. How many types of surface finish ACCPCB can do?

     

    O-the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.


    6. What are the main factors which will affect the price of PCB?

     

    Material;
    Surface finish;

    Board thickness, Copper thickness;
    Technology difficulty;
    Different quality criteria;
    PCB characteristics;
    Payment terms;

     

    7. How to you make the impedance calculation?

     

    The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment.

     

       Edge Plating Multilayer PCB Board under UL, CQC, TS16949, ISO14000, ROHS certification

    Contact Details
    Accuracy Electronics Technologies Co.,Ltd

    Contact Person: sales

    Send your inquiry directly to us (0 / 3000)