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ENGI Surface 1oz 4MIL Multilayer Printed Circuit Board

ENGI Surface 1oz 4MIL Multilayer Printed Circuit Board

ENGI Surface 1oz 4MIL Multilayer Printed Circuit Board
ENGI Surface 1oz 4MIL Multilayer Printed Circuit Board
ENGI Surface 1oz 4MIL Multilayer Printed Circuit Board
Product Details:
Place of Origin: China
Brand Name: ACCPCB
Certification: ISO, UL, SGS,TS16949
Model Number: S1207127
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: Negotiable
Packaging Details: Vacuum packing with desiccant
Delivery Time: 10-12days
Payment Terms: L/C / T/T / Western Union / Paypal
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Detailed Product Description
Product Name: Multilayer Rigid Boards Thickness: 1.50mm
Size: 100mmX60mm Min. Line Spacing: 0.1MM / 4MIL
Board Thickness: 0.5~3.2mm Surface Finishing: Immersion Gold
Copper Thickness: 0.5oz-6oz Min Line Spacing: 4mil (0.1mm)
Min.line Width: 4 Mil ( 0.1mm) Min Drill Hole Size: 0.2mm
High Light:

4MIL Multilayer Printed Circuit Board


1oz Multilayer Printed Circuit Board


0.1MM Multilayer Printed Circuit Board

ENGI Surface 1oz 4MIL Multilayer Printed Circuit Board


Multilayer PCB Board multi layer circuit board with ENGI surface for measuring instrument



Production description :


this board is 6layer with 1oz copper thickness. it is used for measuring  device.  PCB prototype,samll volum, middle and large volume are accepted. no MOQ request for new order. all of these boards are met UL,TS16949, ISO9001 Etc.


Key Specifications of amplifier PCB board:


Production Types: Rigid Multilayer PCB
Layer : 6 layer
Base Material : FR4 
Copper Thickness : 1 oz
Board Thickness : 2.30mm
Min. Finish Hole Size : 8 mil (0.10mm)
Min. Line Width : 4 mil
Min. Line Spacing : 4 mil
Surface Finishing : ENIG
Drilling hole tolerance: +/-3 mil ( 0.075mm )
Min Outline tolerance : +/-4 mil ( 0.10mm )
Working panel size : max:1200mmX600mm (47'' X24'')
Outline profile: Punching, Routing , CNC routing + V-cut
Solder mask : LPI Solder mask, Peelable mask
Solder Mask Color : Blue, black,yellow, matte green
Certificate : UL, CQC, TS16949, ISO14000, ROHS
Silkscreen color : White
Twist and Bow : no more than 0.75 %


PCB Chart.pdf


Products Application:


1, Telecom Communication :wireless LAN card, XDSL router,Servers, Optical Device,Hard Drive etc;


2, Consumer Electronics: TV, DVD,Digital Caramer, air conditoner, Refrigerator,set-top box etc;


3, Security monitor: Moible phone, PDA, GPS, caramer monitor etc;


4, Vehicle Electronices: Car etc;


5, Smart Home: Wearable device ,computers, ipad , Remote Control etc;


6, Industrial controls: Medical device ,UPS equipment, Control device etc;


7, Military & Defense : Military Weapons etc;




Technical Capability:


 ITEMS Capability
 Max. layer count 28L
 Min. line widty 0.08mm
Min. line spacing 0.08mm
 Min. hole size 0.15mm
 Board thickness 0.4-6.0mm
Max. boardsize 520×620mm
(PTH) Hole size tolerance(PTH) ±0.075mm
(NPTH) Hole size tolerance(NPTH) ) ±0.05mm
Holeposition tolerance(Routing) ±0.1mm
 Outline tolerance(Punching) ±0.1mm



ENGI Surface 1oz 4MIL Multilayer Printed Circuit Board 0




1. How do ACCPCB ensure quality?


Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?


Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.

3. What data are needed for PCB production?


PCB Gerber files with RS-274-X format.

4. What’s the typical process flow for multi-layer PCB?


Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.

5. How many types of surface finish ACCPCB can do?


O-the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.

6. What are the main factors which will affect the price of PCB?


Surface finish;

Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;


7. How to you make the impedance calculation?


The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment.

Contact Details
Accuracy Electronics Technologies Co.,Ltd

Contact Person: sales

Tel: +8615889494185

Send your inquiry directly to us (0 / 3000)