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Fast Rapid Universal Prototype PCB Board LPI Solder Mask With Gold Flash

Fast Rapid Universal Prototype PCB Board LPI Solder Mask With Gold Flash

  • Fast Rapid Universal  Prototype PCB Board LPI Solder Mask With Gold Flash
  • Fast Rapid Universal  Prototype PCB Board LPI Solder Mask With Gold Flash
Fast Rapid Universal  Prototype PCB Board LPI Solder Mask With Gold Flash
Product Details:
Place of Origin: China
Brand Name: ACCPCB
Certification: ISO,SGS,TS16949
Model Number: S1069
Payment & Shipping Terms:
Minimum Order Quantity: 1 PCS
Price: Negotiable
Packaging Details: Vacuum packing
Delivery Time: 3-5days
Payment Terms: T/T ,Western Union,Paypal
Supply Ability: 50000SQ.M/Per Month
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Detailed Product Description
Material: FR41g150 Count: Multi Layer / 6 Layer
Surface Finish: Gold Flash Usage: Consumer Electronics
Solder Mask: Green Copper Thickness: 1oz All Layer
Board Thickness: 0.3~2.5mm Min. Hole Size: 0.1mm
Min. Line Spacing: 4mil Min. Line Width: 4mil
Surface Finishing: ENIG
High Light:

prototype circuit board

,

electronic prototype board

Fast Rapid Universal Prototype PCB Board LPI Solder Mask With Gold Flash

 

Production description :

 

this board is 6layer pcb. it is used on electronic control . we can accep PCB prototype,samll volum, middle and large volume. no MOQ request for new boards, for repeat order, just meet 3sq.m.

 

Key Specifications/Special Features:

 

Number of layers:

Mulity Layer / 6 layer

Base material: FR4
Copper thickness: 1.5 oz Cu in all layer
Thickness:

1.58 mm

Size:

150.6 x 200.5 mm

Cooper In holes:

min 20um

Surface finishing:

Gold Flash

Solder mask:

LPI

Solder mask:

Green

Working panel size : max:1200mmX600mm (47'' X24'')
Outline profile: Punching, Routing , CNC routing + V-cut
Certificate : UL, CQC, TS16949, ISO14000, ROHS
Twist and Bow : no more than 0.75 %
Solder mask : LPI Solder mask, Peelable mask

  

PCB Flow Chart.pdf

 

Products Application:

 

1, Consumer Electronics: TV, DVD,Digital Caramer, air conditoner, Refrigerator,set-top box etc;

 

2, Security monitor: Moible phone, PDA, GPS, caramer monitor etc;

 

3, Telecom Communication :wireless LAN card, XDSL router,Servers, Optical Device,Hard Drive etc;

 

4, Industrial controls: Medical device ,UPS equipment, Control device etc;

 

5, Vehicle Electronices: Car etc;

 

6, Military & Defense : Military Weapons etc;

 

Fast Rapid Universal  Prototype PCB Board LPI Solder Mask With Gold Flash 0

Technology Capability:

 

Item Technical Parameters
Layers 1-28 Layers
Inner Layer Min Trace/Space 4/4 mil
Out Layer Min Trace,Space 4/4 mil
Inner Layer Max Copper 4 OZ
Out Layer Max Copper 4 OZ
Inner Layer Min Copper 1/3 oz
Out Layer Min Copper 1/3 oz
Min hole size 0.15 mm
Max.board thickness 6 mm
Min.board thickness 0.2mm
Max.board size 680*1200 mm
PTH Tolerance +/-0.075mm
NPTH Tolerance +/-0.05mm
Countersink Tolerance +/-0.15mm
Board Thickness Tolerance +/-10%
Min BGA 7mil
Min SMT 7*10 mil
Solder mask bridge 4 mil
Solder mask color White,black,blue,green,yellow,red,etc
Legend color White,black,yellow,gray,etc
Surface finish HAL,OSP, Immersion Ni/Au ,Imm silver/SN,ENIG
Board materials FR-4;high TG;HighCTI; halogen free; Aluminum Bsed PCB,high frequency(rogers,isola),copper -base PCB
Impedance control +/-10%
Bow and twist ≤0.5

 

  • Fast Rapid Universal  Prototype PCB Board LPI Solder Mask With Gold Flash 1

 

FAQ

 

1. How do ACCPCB ensure quality?

 

Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?

 

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


3. What data are needed for PCB production?

 

PCB Gerber files with RS-274-X format.


4. What’s the typical process flow for multi-layer PCB?

 

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


5. How many types of surface finish ACCPCB can do?

 

O-the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.


6. What are the main factors which will affect the price of PCB?

 

Material;
Surface finish;

Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;

 

7. How to you make the impedance calculation?

 

The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment.

 

 

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Contact Details
Accuracy Electronics Technologies Co.,Ltd

Contact Person: sales

Tel: +8615889494185

Send your inquiry directly to us (0 / 3000)