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FR4 double sided pcb Prototyping pcb board For robot intelligence device

FR4 double sided pcb Prototyping pcb board For robot intelligence device

  • FR4 double sided pcb Prototyping pcb board For robot intelligence device
  • FR4 double sided pcb Prototyping pcb board For robot intelligence device
FR4 double sided pcb Prototyping pcb board For robot intelligence device
Product Details:
Place of Origin: China
Brand Name: ACCPCB
Certification: ISO,SGS,TS16949
Model Number: P1042
Payment & Shipping Terms:
Minimum Order Quantity: 1 PCS
Price: Negotiable
Packaging Details: Vacuum packing
Delivery Time: 3-5days
Payment Terms: T/T ,Western Union,Paypal
Supply Ability: 50000SQ.M/Per Month
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Detailed Product Description
Material: FR4 Count: 2layer
Surface Finish: Immersion Gold Usage: Electronic Intelligence
Solder Mask: Blue Service: Customize
Base Material: FR-4 Min. Hole Size: 0.1mm
Copper Thickness: 1/2OZ 1OZ 2OZ 3OZ Min. Line Spacing: 0.1mm4mil)
High Light:

quick turn pcb

,

electronic prototype board

FR4 double sided pcb Prototyping pcb board For robot intelligence device

 

Production description :

 

this board is double sides pcb. it is used forrobot ingelligence device . we can accep PCB prototype,samll volum, middle and large volume. no MOQ request for new boards, for repeat order, just meet 3sq.m.

 

Key Specifications/Special Features:

 

Number of layers:

Double sides

Base material:

FR4

Copper thickness:

2 / 2 oz Cu

Thickness:

1.58 mm

Size:

80.6 x 90.5 mm

Cooper In holes:

min 20um

Surface finishing:

immersion gold ( au:2u'')

Solder mask:

Blue

Outline: Routing,V-Groove, Beveling punch
Company type: Manufacturer/ Factory
Min line width/space: 0.10mm / 0.10mm
outline profile : punching, routing, punching+push back
outline tolerance +/-10%
Twist and bow: no more than 0.75%
Impedance control: +/-10%

 

PCB Flow Chart.pdf

 

 

Rigid PCB Technical Capability:

 

Items Technical Capability
Layers 1-28 layers Min. line width/space 4mil

Max.board size (single&doule

sided)

600*1200mm Min.annular ring width: vias 3mil
Surface finish

HAL lead free,gold flash

Immersion silver,Immersion gold ,Immersion Sn,

hard gold,OSP,ect

Min.board thickness(multilayer) 4layers:0.4mm;
6layers:0.6mm;
8layers:1.0mm;
10layers:1.20mm
Board materials

FR-4; high Tg; high CTI; halogen free; high frequency(rogers,taconic,

PTFE,nelcon,

ISOLA,polyclad 370 HR); heavy copper,

Metal base clade laminate

Plating thickness (Technique:

Immersion Ni/Au)

Plating type: Imm Ni, Min./Max thickness:100/150U'' Plating type: Imm Au, Min./Max thickness:2/4U''
Impedance control ± 10%

Distance between

line to board edge

Outline: 0.2mm

V-CUT: 0.4mm

Base copper thickness(Inner

and outer layer)

Min. thickness: 0.5 OZ Max.thickness: 6OZ Min.hole size(board thickness ≥2mm) Aspect ratio≤16
Finished copper thickness Outer layers:
Min.thickness 1 OZ,
Max.thickness 10 OZ
Inner layers:
Min.thickness :0.5OZ,
Max.thickness : 6 OZ
Max.board thickness(single&doule sided) 3.20mm

 

 

Products Application:

 

1, Consumer Electronics: TV, DVD,Digital Caramer, air conditoner, Refrigerator,set-top box etc;

 

2, Security monitor: Moible phone, PDA, GPS, caramer monitor etc;

 

3, Telecom Communication :wireless LAN card, XDSL router,Servers, Optical Device,Hard Drive etc;

 

4, Industrial controls: Medical device ,UPS equipment, Control device etc;

 

5, Vehicle Electronices: Car etc;

 

6, Military & Defense : Military Weapons etc;

 

 

  • FR4 double sided pcb Prototyping pcb board For robot intelligence device 0

 

FAQ

 

1. How do ACCPCB ensure quality?

 

Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?

 

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


3. What data are needed for PCB production?

 

PCB Gerber files with RS-274-X format.


4. What’s the typical process flow for multi-layer PCB?

 

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


5. How many types of surface finish ACCPCB can do?

 

O-the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.


6. What are the main factors which will affect the price of PCB?

 

Material;
Surface finish;

Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;

 

7. How to you make the impedance calculation?

 

The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment.

 

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Contact Details
Accuracy Electronics Technologies Co.,Ltd

Contact Person: sales

Tel: +8615889494185

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