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FR4 Rapid PCB Prototype PCB Board Green Solder Mask for 5G mobile equipment

FR4 Rapid PCB Prototype PCB Board Green Solder Mask for 5G mobile equipment

  • FR4 Rapid PCB Prototype PCB Board Green Solder Mask for 5G mobile equipment
  • FR4 Rapid PCB Prototype PCB Board Green Solder Mask for 5G mobile equipment
FR4 Rapid PCB Prototype PCB Board Green Solder Mask for 5G mobile equipment
Product Details:
Place of Origin: China
Brand Name: ACCPCB
Certification: ISO,SGS,TS16949
Model Number: P1048
Payment & Shipping Terms:
Minimum Order Quantity: 1 PCS
Price: Negotiable
Packaging Details: Vacuum packing
Delivery Time: 3-5days
Payment Terms: T/T ,Western Union,Paypal
Supply Ability: 50000SQ.M/Per Month
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Detailed Product Description
Material: FR4 Count: Multi Layer
Surface Finish: HAL Lead Free Usage: Smart Home Equipment
Solder Mask: Matte Green Copper Thickness: Standard 35um
Board Thickness: 1.6mm-3.2mm Min. Line Spacing: 0.1mm4mil)
Min. Line Width: 4mil Product Name: Printed Circuit Board,94v0 Pcb Board
High Light:

prototype circuit board

,

electronic prototype board

FR4 Rapid PCB Prototype PCB Board Green Solder Mask for 5G mobile equipment

 

Production description :

 

this board is a mulity layer pcb. it is used for 5G mobile equipment. we can accep PCB prototype,samll volum, middle and large volume. no MOQ request for new boards, for repeat order, just meet 3sq.m.

 

Key Specifications/Special Features:

 

Number of layers:

Mulity Layer / 2-12 layer

Base material:

FR4

Copper thickness: 1 oz Cu in all layer
Board Thickness: 1.62 mm
Size:

200.6 x 196.5 mm

Cooper In holes: min 20um
Surface finishing:

lead free HAL

Solder mask:

Green

Legends:

White

Outline profile: Routing,V-Groove, Beveling punch
Working panel size : max:1200mmX600mm (47'' X24'')
Outline profile: Punching, Routing , CNC routing + V-cut
Solder mask : LPI Solder mask, Peelable mask
Twist and Bow : no more than 0.75 %
Certificate : UL, CQC, TS16949, ISO14000, ROHS


 

PCB Flow Chart.pdf

 

 

Products Application:

 

1, Telecom Communication
2, Consumer Electronics
3, Security monitor
4, Vehicle Electronices
5, Smart Home
6, Industrial controls
7, Military & Defense

 

Rigid PCB Technical Capability:

 

Items Technical Capability
Layers 1-28 layers Min. line width/space 4mil

Max.board size (single&doule

sided)

600*1200mm Min.annular ring width: vias 3mil
Surface finish

HAL lead free,gold flash

Immersion silver,Immersion gold ,Immersion Sn,

hard gold,OSP,ect

Min.board thickness(multilayer) 4layers:0.4mm;
6layers:0.6mm;
8layers:1.0mm;
10layers:1.20mm
Board materials

FR-4; high Tg; high CTI; halogen free; high frequency(rogers,taconic,

PTFE,nelcon,

ISOLA,polyclad 370 HR); heavy copper,

Metal base clade laminate

Plating thickness (Technique:

Immersion Ni/Au)

Plating type: Imm Ni, Min./Max thickness:100/150U'' Plating type: Imm Au, Min./Max thickness:2/4U''
Impedance control ± 10%

Distance between

line to board edge

Outline: 0.2mm

V-CUT: 0.4mm

Base copper thickness(Inner

and outer layer)

Min. thickness: 0.5 OZ Max.thickness: 6OZ Min.hole size(board thickness ≥2mm) Aspect ratio≤16
Finished copper thickness Outer layers:
Min.thickness 1 OZ,
Max.thickness 10 OZ
Inner layers:
Min.thickness :0.5OZ,
Max.thickness : 6 OZ
Max.board thickness(single&doule sided) 3.20mm

 

 

  • FR4 Rapid PCB Prototype PCB Board Green Solder Mask for 5G mobile equipment 0

 

FAQ

 

1. How do ACCPCB ensure quality?

 

Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?

 

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


3. What data are needed for PCB production?

 

PCB Gerber files with RS-274-X format.


4. What’s the typical process flow for multi-layer PCB?

 

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


5. How many types of surface finish ACCPCB can do?

 

O-the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.


6. What are the main factors which will affect the price of PCB?

 

Material;
Surface finish;

Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;

 

7. How to you make the impedance calculation?

 

The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment.

 

 

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Contact Details
Accuracy Electronics Technologies Co.,Ltd

Contact Person: sales

Tel: +8615889494185

Send your inquiry directly to us (0 / 3000)