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FR4 TG170 Material High Density PCB Green Color Device Control Motherboard

FR4 TG170 Material High Density PCB Green Color Device Control Motherboard

    • FR4 TG170 Material High Density PCB Green Color Device Control Motherboard
    • FR4 TG170 Material High Density PCB Green Color Device Control Motherboard
  • FR4 TG170 Material High Density PCB Green Color Device Control Motherboard

    Product Details:

    Place of Origin: China
    Brand Name: ACCPCB
    Certification: ISO, UL, SGS,TS16949
    Model Number: P1228

    Payment & Shipping Terms:

    Minimum Order Quantity: 1 PCS
    Price: Negotiable
    Packaging Details: Vacuum packing with desiccant
    Delivery Time: 12-15Days
    Payment Terms: L/C / T/T / Western Union / Paypal
    Supply Ability: 30000SQ.M/PER MONTH
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    Detailed Product Description
    Number Of Layer: 4 L Material: Nanya FR4 Tg170
    Finish Copper Thickness: 1oz Inner Layer / 2 Oz Outlayer Surface Finish: HAL Lead Free
    Min Holes: 0.25mm Application: Communication Device
    High Light:

    fr4 pcb board

    ,

    hdi pcb prototype

    FR4 TG170 Material High Density PCB Green Color Device Control Motherboard

     

    Prodcution Features :

     

    Layer : 4 Layers
    Base Material : FR4tg170
    Copper Thickness :
    1 oz outlayer / 1 oz inner layer
    Board Thickness : 1.20 mm
    Min. Hole Size :  0.3 mm
    Min. Line Width :   0.1 / 0.1 mm
    Min. Line Spacing :   0.1 / 0.1 mm
    Surface Finishing :  HAL Lead free
    Solder Mask Color :  Green 
    Certificate :  UL, CQC, TS16949, ISO14000, ROHS
    PTH tolerance :  +/-3mil
    NPTH tolerance :  +/-2mil
    Silkscreen color :  White


     

     

    Advantages:

     

    • Strict product liability, taking IPC-A-160 standard
    • Engineering pretreatment before production
    • Production process control (5Ms)
    • 100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
    • 100% AOI inspection, including X-ray, 3D microscope and ICT
    • High-voltage test, impedance control test
    • Micro section, soldering capacity, thermal stress test, shocking test
    • In-house PCB production
    • No minimum order quantity and free sample
    • Focus on low to medium volume production
    • Quick and on-time delivery

     

    Full range of testing services:


    ▪ AOI, function testing, In circuit testing
    ▪ 3D paste thickness test
    ▪ Flash testing and earth bonding tests can also be undertaken where required
    ▪ Using our X-ray machine, we test PCBs to component level and all wiring is fully inspected and tested
    ▪ Each board is carefully examined by our dedicated inspection team using AOI and high magnification viewers

     

     

    Shipping Information:


    FOB Port : Hong Kong                                                          Lead Time : 8 - 20 days
    HTS Code : 8534.00.90                                                   Dimensions per Carton : 37X27X22mm
    Weight Per Carton : 20 Kilograms
     

     

    FAQ :

     

    1. How do ACCPCB ensure quality?

     

    Our high quality standard is achieved with the following.

     

    1.1 The process is strictly controlled under ISO 9001:2008 standards.
    1.2 Extensive use of software in managing the production process
    1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
    1.4.Dedicated quality assurance team with failure case analysis process

    2. What kinds of boards can ACCPCB process?

     

    Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


    3. What data are needed for PCB production?

     

    PCB Gerber files with RS-274-X format.


    4. What’s the typical process flow for multi-layer PCB?

     

    Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


    5. How many types of surface finish ACCPCB can do?

     

    O-the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.


    6. What are the main factors which will affect the price of PCB?

     

    Material;
    Surface finish;

    Board thickness, Copper thickness;
    Technology difficulty;
    Different quality criteria;
    PCB characteristics;
    Payment terms;

     

    7. How to you make the impedance calculation?

     

    The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment.

     

    FR4 TG170 Material High Density PCB Green Color Device Control Motherboard

    Contact Details
    Accuracy Electronics Technologies Co.,Ltd

    Contact Person: sales

    Send your inquiry directly to us (0 / 3000)