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Green Fr4 Tg130 1.80mm Multilayer Circuit Board For Led Driver

Green Fr4 Tg130 1.80mm Multilayer Circuit Board For Led Driver

Green Fr4 Tg130 1.80mm Multilayer Circuit Board For Led Driver
Green Fr4 Tg130 1.80mm Multilayer Circuit Board For Led Driver
Green Fr4 Tg130 1.80mm Multilayer Circuit Board For Led Driver
Product Details:
Place of Origin: China
Brand Name: ACCPCB
Certification: ISO, UL, SGS,TS16949
Model Number: P11342
Payment & Shipping Terms:
Minimum Order Quantity: 1 pcs
Price: Negotiable
Packaging Details: Vacuum packing with desiccant
Delivery Time: 5-8DAS
Payment Terms: L/C / T/T / Western Union / Paypal
Supply Ability: 30000SQ.M/PER MONTH
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Detailed Product Description
Base Material: KBfr4 Count Layer: 4layer
Copper Thickness: 1 / 1 / 1 / 1 OZ In All Layer Finish Board Thickness: 1.80mm
Solder Mask: Green Min Line Space: 0.10mm
Min Line Width: 0.10mm Outline Profile: Cnc Routing +V-cuting
Twist And Bow: No More Than 0.75%
High Light:

1.80mm Multilayer Circuit Board


Tg130 Multilayer Circuit Board


Green Fr4 Multilayer PCB

Green Fr4 Tg130 1.80mm Multilayer Circuit Board For Led Driver


Production description :

this board is double sided layer. it is use for LED driver .  no MOQ request for new order. all of our PCB are met UL, TS 16949,ROHS, ISO Etc. certification.we can accept prototype ,small volume , middle volume and large volume.


Key Specifications/Special Features:

Layer count: four sided
Base material : Fr4tg130
Copper thickness : 1 oz in all layer
Board thickness : 1.80mm
Min. hole size : 0.2mm
Min. line width : 5 mils
Min. line spacing : 5 mils
Surface finishing : HAL lead free
Application : Led driver
Board thickness tolerance : ±10%
Twist& wrap : ≤ 0.5%
Outline profile: Punching, Routing , CNC routing + V-cut
Certificate : UL, CQC, TS16949, ISO14000, ROHS
Silkscreen color : White
Twist and Bow : no more than 0.75 %
Copper thickness in hole: 0.02-0.035mm


PCB Flow Chart.pdf


Rigid PCB Technical Capability:

Items Technical Capability
Layers 1-28 layers Min. line width/space 4mil

Max.board size (single&doule


600*1200mm Min.annular ring width: vias 3mil
Surface finish

HAL lead free,gold flash

Immersion silver,Immersion gold ,Immersion Sn,

hard gold,OSP,ect

Min.board thickness(multilayer) 4layers:0.4mm;
Board materials

FR-4; high Tg; high CTI; halogen free; high frequency(rogers,taconic,


ISOLA,polyclad 370 HR); heavy copper,

Metal base clade laminate

Plating thickness (Technique:

Immersion Ni/Au)

Plating type: Imm Ni, Min./Max thickness:100/150U'' Plating type: Imm Au, Min./Max thickness:2/4U''
Impedance control ± 10%

Distance between

line to board edge

Outline: 0.2mm

V-CUT: 0.4mm

Base copper thickness(Inner

and outer layer)

Min. thickness: 0.5 OZ Max.thickness: 6OZ Min.hole size(board thickness ≥2mm) Aspect ratio≤16
Finished copper thickness Outer layers:
Min.thickness 1 OZ,
Max.thickness 10 OZ
Inner layers:
Min.thickness :0.5OZ,
Max.thickness : 6 OZ
Max.board thickness(single&doule sided) 3.20mm

Full range of testing services:
▪ AOI, function testing, In circuit testing, X-ray for BGA testing
▪ 3D paste thickness test
▪ Flash testing and earth bonding tests can also be undertaken where required
▪ Using our X-ray machine, we test PCBs to component level and all wiring is fully inspected and tested
▪ Each board is carefully examined by our dedicated inspection team using AOI and high magnification viewers


Widely used in stage, Industrila control,computer,consuming electronics,security,automotive,power electronics,medical,telecom etc.



Green Fr4 Tg130 1.80mm Multilayer Circuit Board For Led Driver 0




1. How do ACCPCB ensure quality?

   Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?

    Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.

3. What data are needed for PCB production?

    PCB Gerber files with RS-274-X format.

4. What’s the typical process flow for multi-layer PCB?

    Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


5. How to you make the impedance calculation?

   The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment.






Contact Details
Accuracy Electronics Technologies Co.,Ltd

Contact Person: sales

Tel: +8615889494185

Send your inquiry directly to us (0 / 3000)