Green TS 16949 Lead Free Immersion Gold PCB For Display Equipment
Production description :
this board is 10 layer. it is used for display device. we can accept any quantity. all of our PCB are met UL, TS 16949,ROHS, ISO Etc. certification. no MOQ request for new order.
|Base Material :
|Copper Thickness :
||1.58oz in all layer
|Board Thickness :
|Surface Finish :
|Min. Hole Size :
||6 mil, 0.15mm
|Min. Line Width :
||4/4 mil, 0.10/0.10 mm
|Min. Line Spacing :
||ISO9001, UL, ROHS,TS16949
||Punching, Routing , CNC routing + V-cut
|Solder mask :
||LPI Solder mask, Peelable mask
|Solder Mask Color :
||Blue, black,yellow, matte green
||UL, CQC, TS16949, ISO14000, ROHS
|Twist and Bow :
||no more than 0.75 %
ACCPCB Technical Capability.pdf
1, Telecom Communication
2, Consumer Electronics
3, Security monitor
4, Vehicle Electronices
5, Smart Home
6, Industrial controls
7, Military & Defense
1. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process
2. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
3. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
4. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.