|Place of Origin:||China|
|Certification:||ISO, UL, SGS,TS16949|
|Minimum Order Quantity:||1PCS|
|Packaging Details:||Vacuum packing with desiccant|
|Payment Terms:||L/C / D/P / T/T / Western Union / Paypal|
|Surface Finish:||HAL Lead Fee||Application:||Test Equipment|
|Size:||280mmX100mm||Color:||Green Solder Mask|
monitor circuit board,
halogen free pcb
Halogen free Fr4 Lead Free PCB High Precision Fabrication Customized with immersion gold
Production description :
this board is 4layer PCB it is used on test equipment. PCB prototype,samll volum, middle and large volume are accepted. no MOQ request for new boards.
|Base Material:||ITEQ FR4|
|Min. Hole Size:||8mil, 0.2mm|
|Min. Line Width:4/4 mil||0.0762/0.0762 mm|
|Min. Line Spacing:||4/4mil, 0.0762/0.0762mm|
|Surface Finish:||Immersion gold|
|Certification:||ISO9001, UL, ROHS,TS16949|
Quality assurance :
Every production process has a special person to test to ensure quality
Have professional engineers to check the quality
All products have passed CE, FCC, ROHS and other certifications
▪ No MOQ, 14 years of PCB turnkey services
▪ Quick turn, prototype, low & medium & high volume
▪ OEM services provide
▪ ISO 9001-, ISO 14001-, ISO/TS16949, ISO 13485, IATF16949, OHSAS18001 certified
▪ 100% E-test, visual, AOI inspection, including X-ray, 3D microscope
▪ Fast response within 24 hours
|Inner Layer Min Trace/Space||4/4 mil|
|Out Layer Min Trace,Space||4/4 mil|
|Inner Layer Max Copper||4 OZ|
|Out Layer Max Copper||4 OZ|
|Inner Layer Min Copper||1/3 oz|
|Out Layer Min Copper||1/3 oz|
|Min hole size||0.15 mm|
|Max.board thickness||6 mm|
|Max.board size||680*1200 mm|
|Board Thickness Tolerance||+/-10%|
|Min SMT||7*10 mil|
|Solder mask bridge||4 mil|
|Solder mask color||White,black,blue,green,yellow,red,etc|
|Surface finish||HAL,OSP, Immersion Ni/Au ,Imm silver/SN,ENIG|
|Board materials||FR-4;high TG;HighCTI; halogen free; Aluminum Bsed PCB,high frequency(rogers,isola),copper -base PCB|
|Bow and twist||≤0.5|
1. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process
2. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
3. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
4. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.
5. How many types of surface finish ACCPCB can do?
the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.
6. What are the main factors which will affect the price of PCB?
Board thickness, Copper thickness;
Different quality criteria;
7. How to you make the impedance calculation?
The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment.
Contact Person: sales