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HDI PCB Board Multilayer Circuit Board RoHS 94v0 ISO9001 Standards

HDI PCB Board Multilayer Circuit Board RoHS 94v0 ISO9001 Standards

  • HDI PCB Board Multilayer Circuit Board  RoHS 94v0 ISO9001 Standards
  • HDI PCB Board Multilayer Circuit Board  RoHS 94v0 ISO9001 Standards
HDI PCB Board Multilayer Circuit Board  RoHS 94v0 ISO9001 Standards
Product Details:
Place of Origin: China
Brand Name: ACCPCB
Certification: ISO, UL, SGS,TS16949
Model Number: P1193
Payment & Shipping Terms:
Minimum Order Quantity: 1 PCS
Price: Negotiable
Packaging Details: Vacuum packing with desiccant
Delivery Time: 15-20days
Payment Terms: L/C / T/T / Western Union / Paypal
Supply Ability: 25000SQ.M/PER MONTH
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Detailed Product Description
Material: NYFR4TG170 Layer: 8-layer
Feature: Immersion Gold Copper Thickness: 2oz Inner Layer / 2.0oz Outlayer
Board Thickness: 2.3MM
High Light:

high density interconnect pcb

,

double sided copper clad board

HDI PCB Board Multilayer Circuit Board RoHS 94v0 ISO9001 Standards


 PCB capability and services:

  1. Layer: 1 to 20 layers
  2. Materials: FR-4, CEM-3, high TG, FR4 halogen free, FR-1, FR-2, aluminum
  3. Max finished thickness: 0.2 to 4.0mm (0.02-0.25″)
  4. Max finished board side: 500 x 500mm (20 x 20")
  5. Min drilled hole size: 0.25mm (10mil)
  6. Min line width: 0.10mm (4mil)
  7. Min line spacing: 0.10mm (4mil)
  8. Surface finish/treatment: HALS/HALS lead-free, chemical tin, chemical gold, immersion gold, plating gold
  9. Copper thickness: 0.5 to 3.0oz
  10. Solder mask colors: green/black/white/red/blue
  11. Inner packing: plastic bag
  12. Outer packing: standard carton packing
  13. Hole tolerance:
  14. PTH: ±0.076
  15. NTPH: ±0.05
  16. Certifications: UL, ISO 9001, ISO 14001, RoHS Directive-compliant, UL
  17. Profiling punching: routing, V-cut, beveling
  18. Providing OEM service to all sorts of printed circuit board assembly

Lead Time:

 

Types

 

(Max ㎡/month)

Samples

(days)

Mass Production(days)
New PO Repeat PO Urgent
2layer 50000 sq.m/month 2-3 10-11 8-9 4
4layer 5-6 11-12 9-11 5
6layer 6-7 13-14 12-14 6
8layer 7-8 16-18 14-15 7

 
 

Main Export Markets:

  • Asia
  • Australasia
  • North America
  • Western Europe

 
Advantages :


•  Strict product liability, taking IPC-A-160 standard
•  Engineering pretreatment before production
•  Production process control (5Ms)
•  100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
•  100% AOI inspection, including X-ray, 3D microscope and ICT
•  High-voltage test, impedance control test
•  Micro section, soldering capacity, thermal stress test, shocking test
•  In-house PCB production
•  No minimum order quantity and free sample
•  Focus on low to medium volume production
•  Quick and on-time delivery 

 

FAQ

 

1. How do ACCPCB ensure quality?

 

Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?

 

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


3. What data are needed for PCB production?

 

PCB Gerber files with RS-274-X format.


4. What’s the typical process flow for multi-layer PCB?

 

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


5. How many types of surface finish ACCPCB can do?

 

O-the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.


6. What are the main factors which will affect the price of PCB?

 

Material;
Surface finish;

Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;

 

7. How to you make the impedance calculation?

 

The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment.

 

HDI PCB Board Multilayer Circuit Board  RoHS 94v0 ISO9001 Standards 0

 

Contact Details
Accuracy Electronics Technologies Co.,Ltd

Contact Person: sales

Tel: +8615889494185

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