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Immersion Gold Blank PCB Board Black Solder Mask Micro Section For Pose Machine

Immersion Gold Blank PCB Board Black Solder Mask Micro Section For Pose Machine

    • Immersion Gold Blank PCB Board Black Solder Mask Micro Section For Pose Machine
    • Immersion Gold Blank PCB Board Black Solder Mask Micro Section For Pose Machine
  • Immersion Gold Blank PCB Board Black Solder Mask Micro Section For Pose Machine

    Product Details:

    Place of Origin: China
    Brand Name: ACCPCB
    Certification: ISO,UL,SGS,TS16949,ROHS
    Model Number: P1218

    Payment & Shipping Terms:

    Minimum Order Quantity: 1 PCS
    Price: Negotiable
    Packaging Details: Vacuum Packing With Desiccant
    Delivery Time: 6-10days
    Payment Terms: T/T / Western Union / Paypal
    Supply Ability: 35,000SQ.M/Per Month
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    Detailed Product Description
    Finish Thickness: 1.20±10%mm Minimum Via Dia: 0.15mm
    Surface Finish: Immersion Gold Dielectric Constant: 4.2
    Application: Pose Machines
    High Light:

    pwb printed wiring board

    ,

    pwa printed wiring assembly

    Immersion Gold Blank PCB Board Black Solder Mask Micro Section For Pose Machine

    PCB Assembly capability and services:

     

    1) Professional Surface-mounting and Through-hole soldering Technology

    2) Various sizes like 1206,0805,0603,0402,0201components SMT technology

    3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.

    4) PCB Assembly With UL,CE,FCC,Rohs Approval

    5) Nitrogen gas reflow soldering technology for SMT.

    6) High Standard SMT&Solder Assembly Line

    7) High density interconnected board placement technology capacity.

     

    Immersion Gold Blank PCB Board Black Solder Mask Micro Section For Pose Machine

     

    Key Specifications/Special Features:

     

    Material :

    FR4 8layer

    Finish thickness :

    1.20 ±10%mm

    Minimum width/spacing : 0.1MM
    Minimum via dia : 0.2MM
    Surface finish :  iMmmersion god
    Immpedance : 50ohm
    Legends : White
    Certification :
    • ISO UL ROHS SGS
       

     

     

    Advantages:


    ▪ No MOQ, 14 years of PCB turnkey services
    ▪ Quick turn, prototype, low & medium & high volume
    ▪ OEM services provide
    ▪ ISO 9001-, ISO 14001-, ISO/TS16949, ISO 13485, IATF16949, OHSAS18001 certified
    ▪ 100% E-test, visual, AOI inspection, including X-ray, 3D microscope
    ▪ Fast response within 24 hours

     

    Main Export Markets:

    • Asia
    • Australasia
    • Central/South America
    • Eastern Europe
    • Mid East/Africa
    • North America
    • Western Europe

     

     

    Shipping Information :

     

    FOB Port :  Hong Kong / Shenzhen 

    Lead Time :  6-10 days

    HTS Code :  8534.00.10 

    Dimensions Per Carton : 37X27X22 cm

    Weight Per Carton : 20 Kilograms

                                   

     

    FAQ :

     

    1. How do ACCPCB ensure quality?

     

    Our high quality standard is achieved with the following.

    1.1 The process is strictly controlled under ISO 9001:2008 standards.
    1.2 Extensive use of software in managing the production process
    1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
    1.4.Dedicated quality assurance team with failure case analysis process

    2. What kinds of boards can ACCPCB process?

     

    Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


    3. What data are needed for PCB production?

     

    PCB Gerber files with RS-274-X format.


    4. What’s the typical process flow for multi-layer PCB?

     

    Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


    5. How many types of surface finish ACCPCB can do?

     

    O-the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.


    6. What are the main factors which will affect the price of PCB?

     

    Material;
    Surface finish;

    Board thickness, Copper thickness;
    Technology difficulty;
    Different quality criteria;
    PCB characteristics;
    Payment terms;

     

     

    7. How to you make the impedance calculation?

     

    The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment.

     

                 Immersion Gold Blank PCB Board Black Solder Mask Micro Section For Pose Machine

     

    Contact Details
    Accuracy Electronics Technologies Co.,Ltd

    Contact Person: sales

    Send your inquiry directly to us (0 / 3000)