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Interconnect Hdi Printed Circuit Boards High Density Precision for Artificial intelligence equipment

Interconnect Hdi Printed Circuit Boards High Density Precision for Artificial intelligence equipment

  • Interconnect Hdi Printed Circuit Boards High Density Precision for Artificial intelligence equipment
  • Interconnect Hdi Printed Circuit Boards High Density Precision for Artificial intelligence equipment
Interconnect Hdi Printed Circuit Boards High Density Precision for Artificial intelligence equipment
Product Details:
Place of Origin: China
Brand Name: ACCPCB
Certification: ISO, UL, SGS,TS16949
Model Number: P1147
Payment & Shipping Terms:
Minimum Order Quantity: 1 PCS
Price: Negotiable
Packaging Details: Vacuum packing with desiccant
Delivery Time: 15-20days
Payment Terms: L/C / T/T / Western Union / Paypal
Supply Ability: 25000SQ.M/PER MONTH
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Detailed Product Description
Material: ShengyiFR4TG150 Layer: 4 Layer
Feature: Immersion Tin Copper Thickness: 2oz Inner Layer / 2.5oz Outlayer
Board Thickness: 1.20MM
High Light:

double sided copper clad board

,

hdi circuit boards

Interconnect Hdi Printed Circuit Boards High Density Precision for Artificial intelligence equipment

 

Key Specifications/Special Features:

 

Number of layers : 4layer
Base-material : Shengyi FR4TG150
Thickness : 1.20 mm+/-10%
Final-Cu : 70um
Blind and buried via : Yes
Min. Drill hole : 0.4mm
Min. Line space : 0.6mm
Min. Line width : 0.6mm
Mech. treatment : Routing +v-cuting
Surface treatment : Immersion tin
Solder-mask : Red
Legend-Print : white
100% E-test : Yes


 
Lead Time:

Types

 

(Max ㎡/month)

Samples

(days)

Mass Production(days)
New PO Repeat PO Urgent
2layer 50000 sq.m/month 2-3 10-11 8-9 4
4layer 5-6 11-12 9-11 5
6layer 6-7 13-14 12-14 6
8layer 7-8 16-18 14-15 7

 
 

Main Export Markets:

  • Asia : Main 2-8layer
  • Australasia : 2--10layer
  • North America : 4layer over
  • Western Europe : 4--12layer

 
Advantages :


•  Strict product liability, taking IPC-A-160 standard
•  Engineering pretreatment before production
•  Production process control (5Ms)
•  100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
•  100% AOI inspection, including X-ray, 3D microscope and ICT
•  High-voltage test, impedance control test
•  Micro section, soldering capacity, thermal stress test, shocking test
•  In-house PCB production
•  No minimum order quantity and free sample
•  Focus on low to medium volume production
•  Quick and on-time delivery 

 

 

 

FAQ

 

1. How do ACCPCB ensure quality?

 

Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?

 

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


3. What data are needed for PCB production?

 

PCB Gerber files with RS-274-X format.


4. What’s the typical process flow for multi-layer PCB?

 

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


5. How many types of surface finish ACCPCB can do?

 

O-the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.


6. What are the main factors which will affect the price of PCB?

 

Material;
Surface finish;

Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;

 

7. How to you make the impedance calculation?

 

The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment.

 

 

Interconnect Hdi Printed Circuit Boards High Density Precision for Artificial intelligence equipment 0

 

Contact Details
Accuracy Electronics Technologies Co.,Ltd

Contact Person: sales

Tel: +8615889494185

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