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ITEQ FR4 1.35mm Prototype Pcb Fabrication For Car Gps Device

ITEQ FR4 1.35mm Prototype Pcb Fabrication For Car Gps Device

  • ITEQ FR4 1.35mm Prototype Pcb Fabrication For Car Gps Device
  • ITEQ FR4 1.35mm Prototype Pcb Fabrication For Car Gps Device
ITEQ FR4 1.35mm Prototype Pcb Fabrication For Car Gps Device
Product Details:
Place of Origin: China
Brand Name: ACCPCB
Certification: ISO,SGS,TS16949
Model Number: P10423
Payment & Shipping Terms:
Minimum Order Quantity: 1 PCS
Price: Negotiable
Packaging Details: Vacuum packing
Delivery Time: 3-5days
Payment Terms: T/T ,Western Union,Paypal
Supply Ability: 50000SQ.M/Per Month
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Detailed Product Description
Material: Iteq FR4 Count: 12layer
Surface Finish: ENIG Usage: Electronic Car GPS Device
Solder Mask: Green Service: Customize
Min. Hole Size: 0.1mm Copper Thickness: 1oz
Min. Line Spacing: 0.1mm4mil) Silkscreen Color: White Or On Your Request.
High Light:

1.35mm Prototype Pcb Fabrication


ITEQ FR4 Prototype Pcb Fabrication


ITEQ FR4 Prototype Pcb

ITEQ FR4 1.35mm Prototype Pcb Fabrication For Car Gps Device


Production description :

this board is 12 layer pcb. it is used car GPS device . All of  PCB are met ISO9001, TS16940, ROHS certifacation etc. no MOQ request for new boards, for repeat order, just meet 3sq.m.


Key Specifications/Special Features:

Number of layers:

12 layer rigid board

Base material:


Copper thickness:

1 oz Cu


1.35 mm


80.00 x 100.00 mm

Cooper In holes:

min 20um

Surface finishing:

immersion gold ( au:2u'')

Solder mask:



Routing,V-Groove, Beveling punch

Company type:

Manufacturer/ Factory

Min line width/space:

0.10mm / 0.10mm

outline profile :

punching, routing, punching+push back

outline tolerance


Twist and bow:

no more than 0.75%

Impedance control:



PCB Flow Chart.pdf



Rigid PCB Technical Capability:


Technical Capability


1-28 layers

Min. line width/space


Max.board size (single&doule



Min.annular ring width: vias


Surface finish

HAL lead free,gold flash

Immersion silver,Immersion gold ,Immersion Sn,

hard gold,OSP,ect

Min.board thickness(multilayer)





Board materials

FR-4; high Tg; high CTI; halogen free; high frequency(rogers,taconic,


ISOLA,polyclad 370 HR); heavy copper,

Metal base clade laminate

Plating thickness (Technique:

Immersion Ni/Au)

Plating type: Imm Ni, Min./Max thickness:100/150U'' Plating type: Imm Au, Min./Max thickness:2/4U''

Impedance control

± 10%

Distance between

line to board edge

Outline: 0.2mm

V-CUT: 0.4mm

Base copper thickness(Inner

and outer layer)

Min. thickness: 0.5 OZ Max.thickness: 6OZ

Min.hole size(board thickness ≥2mm)

Aspect ratio≤16

Finished copper thickness

Outer layers:

Min.thickness 1 OZ,

Max.thickness 10 OZ

Inner layers:

Min.thickness :0.5OZ,

Max.thickness : 6 OZ

Max.board thickness(single&doule sided)




Products Application:

1, Consumer Electronics: TV, DVD,Digital Caramer, air conditoner, Refrigerator,set-top box etc;

2, Security monitor: Moible phone, PDA, GPS, caramer monitor etc;

3, Telecom Communication :wireless LAN card, XDSL router,Servers, Optical Device,Hard Drive etc;

4, Industrial controls: Medical device ,UPS equipment, Control device etc;

5, Vehicle Electronices: Car etc;

6, Military & Defense : Military Weapons etc;


  • ITEQ FR4 1.35mm Prototype Pcb Fabrication For Car Gps Device 0




1. How do ACCPCB ensure quality?

Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?

  Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.

3. What data are needed for PCB production?

   PCB Gerber files with RS-274-X format.

4. What’s the typical process flow for multi-layer PCB?

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.




Contact Details
Accuracy Electronics Technologies Co.,Ltd

Contact Person: sales

Tel: +8615889494185

Send your inquiry directly to us (0 / 3000)