|Place of Origin:||China|
|Certification:||ISO, UL, SGS,TS16949|
|Minimum Order Quantity:||1-5PCS|
|Packaging Details:||Vacuum packaging|
|Payment Terms:||L/C / T/T / Western Union / Paypal|
|Supply Ability:||30,000SQ.M/PER MONTH|
|Material:||KBFR4||Holes Copper Thickness:||20um|
|Min. Hole Size:||0.15mm||Surface Finishing:||LEAD FREE HAL|
|Copper Thickness:||0.5 OZ--2.0OZ||Silkscreen:||White|
double sided fr4 pcb,
dual layer pcb
OEM 94v0 Impedance Control PCB 20um of Holes Copper 8layer 1.20mm thickness
Key Specifications/Special Features :
|Base Material :||KB FR4|
|Board Thickness :||1.58 mm|
|Layers :||8 layers|
|Copper thickness :||1.2 OZ In all layer|
|Surface Finish :||Immersion gold|
|Copper Thickness in Hole :||min 20um|
|Min. Hole Size :||0.20mm|
|Min. Line Width :||0.1mm/4mil|
|Min. Line Spacing :||4/4mil(0.1/0.1mm)|
Quality assurance :
Every production process has a special person to test to ensure quality, AOI, E-testing, Flying Probe Test.
Have professional engineers to check the quality
All products have passed CE, FCC, ROHS and other certifications
Widely used in stage, Industrila control,computer,consuming electronics,security,automotive,power electronics,medical,telecom etc.
Lead Time :
|Lead Time||2 /L||4 /L||6/ L||8/ L|
1. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process
2. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
3. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
4. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.
Contact Person: sales