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OEM Gold Finger Impedance Control PCB Blind and Buried Vias For Computer Electronics

OEM Gold Finger Impedance Control PCB Blind and Buried Vias For Computer Electronics

OEM Gold Finger Impedance Control PCB Blind and Buried Vias For Computer Electronics
OEM Gold Finger Impedance Control PCB Blind and Buried Vias For Computer Electronics
OEM Gold Finger Impedance Control PCB Blind and Buried Vias For Computer Electronics
Product Details:
Place of Origin: China
Brand Name: ACCPCB
Certification: ISO, UL, SGS,TS16949
Model Number: P1082
Payment & Shipping Terms:
Minimum Order Quantity: 1-5PCS
Price: Negotiable
Packaging Details: Vacuum packaging
Delivery Time: 12-16days
Payment Terms: L/C / T/T / Western Union / Paypal
Supply Ability: 50000SQ.M/PER MONTH
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Detailed Product Description
Material: FR4 Layer: 12L
Surface Finish: Gold Finger Thickness: 1.60mm
Solder Mask: Green Board Thickness: 0.2-3.0mm
Application: Computer Electronics Service: OEM Services Provided
Pcb: Support OEM,Customized PCB Factory
High Light:

custom printed circuit board

,

dual layer pcb

OEM Gold Finger Impedance Control PCB Blind and Buried Vias For Computer Electronics

PCB Flow Chart.pdf

 

Key Specifications/Special Features :

Base Material : FR4
Board Thickness : 1.60mm
Layers : 2-16 layers
Copper thickness : 1.2 OZ in all layer
Surface Finish : Gold Finger
Impedance : 90Ohm
Min. Hole Size : 0.20mm
Min. Line Width : 0.1mm/4mil
Min. Line Spacing : 4/4mil
Solder Mask Color: Green
Outline: Routing,V-Groove, Beveling punch
Company type: Manufacturer/ Factory
Certificate: UL, CQC, TS16949, ISO14000, ROHS

 

Quality assurance :

Every production process has a special person to test to ensure quality, AOI, E-testing, Flying Probe Test.
Have professional engineers to check the quality
All products have passed CE, FCC, ROHS and other certifications

 

Application:
Widely used in stage, Industrila control,computer,consuming electronics,security,automotive,power electronics,medical,telecom etc.

 

Lead Time : 

Lead Time 2 / L 4 / L 6 / L 8 / L
Sample Order 3-5days 6-8days 10-12days 12-14days
Mass Production 7-9days 8-10days 12-15days 15-18days
 

FAQ :

1. What kinds of boards can ACCPCB process?

   Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


2. What data are needed for PCB production?

  PCB Gerber files with RS-274-X format.


3. What’s the typical process flow for multi-layer PCB?

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


4. How many types of surface finish ACCPCB can do?

   the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.


5. What are the main factors which will affect the price of PCB?

Material;

Surface finish;

Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;

 

6. How do ACCPCB ensure quality?

Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

 

      OEM Gold Finger Impedance Control PCB Blind and Buried Vias For Computer Electronics 0

Contact Details
Accuracy Electronics Technologies Co.,Ltd

Contact Person: sales

Tel: +8615889494185

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