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OEM ODM 0.8mm lead free PCB HAL 2oz copper thickness

OEM ODM 0.8mm lead free PCB HAL 2oz copper thickness

OEM ODM 0.8mm lead free PCB HAL 2oz copper thickness
OEM ODM 0.8mm lead free PCB HAL 2oz copper thickness
OEM ODM 0.8mm lead free PCB HAL 2oz copper thickness
Product Details:
Place of Origin: China
Brand Name: ACCPCB
Certification: ISO, UL, SGS,TS16949
Model Number: P1100
Payment & Shipping Terms:
Minimum Order Quantity: 20PCS
Price: Negotiable
Packaging Details: Vacuum packing with desiccant
Delivery Time: 8-15 Days
Payment Terms: L/C / D/A / T/T / Western Union
Supply Ability: 30,000SQ.M/PER MONTH
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Detailed Product Description
Material: FR4 TG150 Thickness: 1.80mm
Size: 100mmX260mm Number Of Layers: 6layer
Min. Line Spacing: 0.1mm4mil) Surface Finishing: Gold Plating
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OEM ODM High TG PCB 0.8mm thickness 0.2mm holes size and lead free HAL 2oz copper thickness



Key Specifications/Special Features :

Layer : 4Layers
Base Material : Nanya FR4TG150
Holes : Buried and Blinded holes
Board Thickness : 1.80mm
Min. Hole Size : 6mil, 0.15mm
Min. Line Width : 4/4 mil
Min. Line Spacing : 4/4mil
Surface Finishing : Lead Free HAL
Solder Mask Color : Green ,Red,Blue,White,Yellow,Red
Certificate : UL, CQC, TS16949, ISO14000, ROHS
Silkscreen color : White,Yellow,Red,Black
Outline : Routing,V-Groove, Beveling punch




Industril Control System
Power Supply
LED drive, LED Lighting
Communication Device
automotive electronics
Security Electronics
Household Control
Digital Appliances
Frequency converter
Medical Device



Technology Capability:

Item Technical Parameters
Layers 1-28 Layers
Inner Layer Min Trace/Space 4/4 mil
Out Layer Min Trace,Space 4/4 mil
Inner Layer Max Copper 4 OZ
Out Layer Max Copper 4 OZ
Inner Layer Min Copper 1/3 oz
Out Layer Min Copper 1/3 oz
Min hole size 0.15 mm
Max.board thickness 6 mm
Min.board thickness 0.2mm
Max.board size 680*1200 mm
PTH Tolerance +/-0.075mm
NPTH Tolerance +/-0.05mm
Countersink Tolerance +/-0.15mm
Board Thickness Tolerance +/-10%
Min BGA 7mil
Min SMT 7*10 mil
Solder mask bridge 4 mil
Solder mask color White,black,blue,green,yellow,red,etc
Legend color White,black,yellow,gray,etc
Surface finish HAL,OSP, Immersion Ni/Au ,Imm silver/SN,ENIG
Board materials FR-4;high TG;HighCTI; halogen free; Aluminum Bsed PCB,high frequency(rogers,isola),copper -base PCB
Impedance control +/-10%
Bow and twist ≤0.5




1. What kinds of boards can ACCPCB process?

   Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.

2. What data are needed for PCB production?

   PCB Gerber files with RS-274-X format.

3. What’s the typical process flow for multi-layer PCB?

   Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.

4. How many types of surface finish ACCPCB can do?

   the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.



            OEM ODM 0.8mm lead free PCB HAL 2oz copper thickness 0

Contact Details
Accuracy Electronics Technologies Co.,Ltd

Contact Person: sales

Tel: +8615889494185

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