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PWB Printed Circuit Board Assembly High CTI Material For Electronic Device Application

PWB Printed Circuit Board Assembly High CTI Material For Electronic Device Application

  • PWB Printed Circuit Board Assembly High CTI Material For Electronic Device Application
  • PWB Printed Circuit Board Assembly High CTI Material For Electronic Device Application
PWB Printed Circuit Board Assembly High CTI Material For Electronic Device Application
Product Details:
Place of Origin: China
Brand Name: ACCPCB
Certification: ISO,UL,SGS,TS16949,ROHS
Model Number: P1221
Payment & Shipping Terms:
Minimum Order Quantity: 1 PCS
Price: Negotiable
Packaging Details: Vacuum Packing With Desiccant
Delivery Time: 6-10days
Payment Terms: T/T / Western Union / Paypal
Supply Ability: 35,000SQ.M/Per Month
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Detailed Product Description
Finish Thickness: 1.60±10%mm Minimum Via Dia: 0.2mm
Surface Finish: Immersion Gold Material: ITEQ FR4
Application: Medical Sphygmomanometer Solder Mask: Red
High Light:

pwb printed wiring board

,

pwb assembly

PWB Printed Circuit Board Assembly High CTI Material for Electronic Device Application

 

Our PCB order capability:

     

Layer :

up to 20 layers

Materials : FR-4, FR4 High Tg/ High CTI Material
TG :

130-180

Surface :

HASL LF , Immersion Gold/Silver/Tin, OSP, Gold Plated

Min drill size : 0.10mm
Min track/spacing :

4/4-mil

Buried and blind via : 0.15MM
Outline :

CNC Milling and V-cut

Solder mask colors : Green, Blue, Black, White, Red and Yellow, Matte green, Matte black, Matte Blue
Silkscreen colors :

black, white and yellow

Impedance control

 yes

Blue Peelable Mask

 yes
Company type: Manufacturer/ Factory
Outline: Routing,V-Groove, Beveling punch

  

 

Main Export Markets:

  • Asia
  • Australasia
  • Central/South America
  • Eastern Europe
  • Mid East/Africa
  • North America
  • Western Europe

 

 

Shipping Information :

 

FOB Port :  Hong Kong / Shenzhen 

Lead Time :  6-10 days

HTS Code :  8534.00.10 

Dimensions Per Carton : 37X27X22 cm

Weight Per Carton : 20 Kilograms

                       

 

FAQ

 

1. How do ACCPCB ensure quality?

 

Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?

 

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


3. What data are needed for PCB production?

 

PCB Gerber files with RS-274-X format.


4. What’s the typical process flow for multi-layer PCB?

 

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


5. How many types of surface finish ACCPCB can do?

 

O-the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.


6. What are the main factors which will affect the price of PCB?

 

Material;
Surface finish;

Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;

 

7. How to you make the impedance calculation?

 

The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment

 

 

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Contact Details
Accuracy Electronics Technologies Co.,Ltd

Contact Person: sales

Tel: +8615889494185

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