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RoHS 94v0 UL Green 12 Layer FR4 TG180 Printed PCB Board

RoHS 94v0 UL Green 12 Layer FR4 TG180 Printed PCB Board

RoHS 94v0 UL Green 12 Layer FR4 TG180 Printed PCB Board
RoHS 94v0 UL Green 12 Layer FR4 TG180 Printed PCB Board
RoHS 94v0 UL Green 12 Layer FR4 TG180 Printed PCB Board
Product Details:
Place of Origin: China
Brand Name: ACCPCB
Certification: ISO, UL, SGS,TS16949
Model Number: P113156
Payment & Shipping Terms:
Minimum Order Quantity: 1 pcs
Price: Negotiable
Packaging Details: Vacuum packing with desiccant
Delivery Time: 5-8DAS
Payment Terms: L/C / T/T / Western Union / Paypal
Supply Ability: 30000SQ.M/PER MONTH
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Detailed Product Description
Count Layer: 12 Layer Copper Thickness: 1 OZ In All Layer
Finish Board Thickness: 1.80mm Solder Mask: Green
Board Size: 120X100mm Min. Line Spacing: 0.1mm
Min. Line Width: 0.1mm Min. Hole Size: 0.1mm
Application: Wilresss Card Solder Mask Color: Green
High Light:

TG180 Printed PCB Board


1OZ Printed PCB Board


94v0 UL Printed PCB Board

RoHS 94v0 UL Green 12 Layer FR4 TG180 Printed PCB Board


12layer FR4 TG180 High density PCB with Green Soldermask RoHS 94v0 UL Compliance
Production description :
this board is 12layer with 1oz copper thickness. it is used on  wireless card . PCB prototype,small volum, middle and large volume are accepted. no MOQ request for new boards. for repeat order, just meet 3sq.m.
PCB Flow Chart.pdf
Key Specifications/Special Features:

Base material : fiberglass FR4tg180
Copper thickness : 1 oz layer
Board thickness : 1.60 mm
Min. hole size : 0.6mm
Min. line width : 4 mils
Min. line spacing : 4 mils
Surface finishing : ENIG
Board thickness tolerance : ±10%
Twist& wrap : ≤ 0.5%
Certificate : RoHS, ISO 9001, UL
Solder Mask Color : Blue, black,yellow, matte green
Certificate : UL, CQC, TS16949, ISO14000, ROHS
Twist and Bow : no more than 0.75 %
Outline profile: Punching, Routing , CNC routing + V-cut


Technology Capability:

Item Technical Parameters
Layers 1-28 Layers
Inner Layer Min Trace/Space 4/4 mil
Out Layer Min Trace,Space 4/4 mil
Inner Layer Max Copper 4 OZ
Out Layer Max Copper 4 OZ
Inner Layer Min Copper 1/3 oz
Out Layer Min Copper 1/3 oz
Min hole size 0.15 mm
Max.board thickness 6 mm
Min.board thickness 0.2mm
Max.board size 680*1200 mm
PTH Tolerance +/-0.075mm
NPTH Tolerance +/-0.05mm
Countersink Tolerance +/-0.15mm
Board Thickness Tolerance +/-10%
Min BGA 7mil
Min SMT 7*10 mil
Solder mask bridge 4 mil
Solder mask color White,black,blue,green,yellow,red,etc
Legend color White,black,yellow,gray,etc
Surface finish HAL,OSP, Immersion Ni/Au ,Imm silver/SN,ENIG
Board materials FR-4;high TG;HighCTI; halogen free; Aluminum Bsed PCB,high frequency(rogers,isola),copper -base PCB
Impedance control +/-10%
Bow and twist ≤0.5


RoHS 94v0 UL Green 12 Layer FR4 TG180 Printed PCB Board 0


 1, Security monitor: Moible phone, PDA, GPS, caramer monitor etc;
 2, Telecom Communication :wireless LAN card, XDSL router,Servers, Optical Device,Hard Drive etc;
 3, Consumer Electronics: TV, DVD,Digital Caramer, air conditoner, Refrigerator,set-top box etc;
 4, Vehicle Electronices: Car etc;
 5, Industrial controls: Medical device ,UPS equipment, Control device etc;
 6, Military & Defense : Military Weapons etc;

1. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?
   Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.

3. What data are needed for PCB production?
   PCB Gerber files with RS-274-X format.

4. How many types of surface finish ACCPCB can do?
O-the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.

5. How to you make the impedance calculation?
   The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment.







Contact Details
Accuracy Electronics Technologies Co.,Ltd

Contact Person: sales

Tel: +8615889494185

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