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| Place of Origin: | China |
| Brand Name: | ACCPCB |
| Certification: | ISO, UL, SGS,TS16949 |
| Model Number: | S10-0019B |
| Minimum Order Quantity: | 1PCS |
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| Price: | Negotiable |
| Packaging Details: | Vacuum packing with desiccant |
| Delivery Time: | 10-12days |
| Payment Terms: | L/C / T/T / Western Union / Paypal |
| Count: | 4 Layer | Material: | FR4 |
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| Pcb Standard: | IPC-A-610 E Class II-III | Copper Thickness: | 2oz |
| Board Thickness: | 0.5~3.2mm | Application: | Electronics Device |
| High Light: | multilayer printed circuit board,fr4 double sided pcb |
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Rigid Multilayer PCB Board Blind and buried Vias 1 Oz Inner Out Copper Layer
| Count : | 4 Layers |
| Base Material : | Nan ya FR4 |
| Copper Thickness : | 1 oz inner layer / 1oz outlayer |
| Board Thickness : | 1.62 mm |
| Vias : | vias on the pads pluged in resin |
| Min. Hole Size : | 4 mil, 0.1mm |
| Min. Line Width : | 4 / 4 mil |
| Min. Line Spacing : | 4 / 4 mil |
| Surface Finishing : | ENIG (AU:2U'') |
| Company type: | Manufacturer/ Factory |
Advantages :
• Strict product liability, taking IPC-A-160 standard
• Engineering pretreatment before production
• Production process control (5Ms)
• 100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
• 100% AOI inspection, including X-ray, 3D microscope and ICT
• High-voltage test, impedance control test
• Micro section, soldering capacity, thermal stress test, shocking test
• In-house PCB production
• No minimum order quantity and free sample
• Focus on low to medium volume production
• Quick and on-time delivery
Technical Capability:
| ITEMS | Capability |
| Max. layer count | 28L |
| Min. line widty | 0.08mm |
| Min. line spacing | 0.08mm |
| Min. hole size | 0.15mm |
| Board thickness | 0.4-6.0mm |
| Max. boardsize | 520×620mm |
| (PTH) Hole size tolerance(PTH) | ±0.075mm |
| (NPTH) Hole size tolerance(NPTH) ) | ±0.05mm |
| Holeposition tolerance(Routing) | ±0.1mm |
| Outline tolerance(Punching) | ±0.1mm |
FAQ:
1. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
2. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
3. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.
4. How many types of surface finish ACCPCB can do?
the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.
5. What are the main factors which will affect the price of PCB?
Material;
Surface finish;
Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;
6. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process
Contact Person: sales
Tel: +8615889494185
