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OEM Cistomized HDI PCB Board ENIG Surface Finish 6 Layer 2 Step ITEQ FR4 TG150

OEM Cistomized HDI PCB Board ENIG Surface Finish 6 Layer 2 Step ITEQ FR4 TG150

OEM Cistomized HDI PCB Board ENIG Surface Finish 6 Layer 2 Step ITEQ FR4 TG150
OEM Cistomized HDI PCB Board ENIG Surface Finish 6 Layer 2 Step ITEQ FR4 TG150
OEM Cistomized HDI PCB Board ENIG Surface Finish 6 Layer 2 Step ITEQ FR4 TG150
Product Details:
Place of Origin: China
Brand Name: ACCPCB
Certification: ISO, UL, SGS,TS16949
Model Number: P1150
Payment & Shipping Terms:
Minimum Order Quantity: 1 PCS
Price: Negotiable
Packaging Details: Vacuum packing with desiccant
Delivery Time: 15-20days
Payment Terms: L/C / T/T / Western Union / Paypal
Supply Ability: 25000SQ.M/PER MONTH
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Detailed Product Description
Material: ITEQ FR4TG150 Layer: 6-layer 2 Step
Feature: ENGI Copper Thickness: 0.5oz Inner Layer / 1.0oz Outlayer
Board Thickness: 0.6MM
High Light:

high density interconnect pcb

,

hdi circuit boards

OEM Cistomized HDI PCB Board ENIG Surface Finish 6 Layer 2 Step ITEQ FR4 TG150
 

Key Specifications/Special Features:

Layer : 6 Layers
Base Material : ITEQFR4 TG150
Copper Thickness : 0.5oz inner layer / 1oz outlayer
Board Thickness : 0.80mm
Min. Hole Size : 6 mil / 0.15mm
Solder mask : White
Min. Line Width : 5mil
Min. Line Spacing : 5milMin
Clearance of Hole to Line : 0.2mm
Origin : Shenzhen, China

PCB Flow Chart.pdf

ACCPCB Technical Capability.pdf

 
Lead Time:

Types

 

(Max ㎡/month)

Samples

(days)

Mass Production(days)
New PO Repeat PO Urgent
2layer 50000 sq.m/month 2-3 10-11 8-9 4
4layer 5-6 11-12 9-11 5
6layer 6-7 13-14 12-14 6
8layer 7-8 16-18 14-15 7

 

Main Export Markets:

  • Asia
  • Australasia
  • North America
  • Western Europe

 
Advantages :
•  Strict product liability, taking IPC-A-160 standard
•  Engineering pretreatment before production
•  Production process control (5Ms)
•  100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
•  100% AOI inspection, including X-ray, 3D microscope and ICT
•  High-voltage test, impedance control test
•  Micro section, soldering capacity, thermal stress test, shocking test
•  In-house PCB production
•  No minimum order quantity and free sample
•  Focus on low to medium volume production
•  Quick and on-time delivery 

 

FAQ:
1. What kinds of boards can ACCPCB process?

   Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


2. What data are needed for PCB production?

   PCB Gerber files with RS-274-X format.


3. What’s the typical process flow for multi-layer PCB?

   Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


4. How many types of surface finish ACCPCB can do?

   the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.

 

5. How do ACCPCB ensure quality?

Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

OEM Cistomized HDI PCB Board ENIG Surface Finish 6 Layer 2 Step ITEQ FR4 TG150 0粘贴

Contact Details
Accuracy Electronics Technologies Co.,Ltd

Contact Person: sales

Tel: +8615889494185

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