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| Place of Origin: | China |
| Brand Name: | ACCPCB |
| Certification: | ISO, UL, SGS,TS16949 |
| Model Number: | P1133 |
| Minimum Order Quantity: | 1 pcs |
|---|---|
| Price: | Negotiable |
| Packaging Details: | Vacuum packing with desiccant |
| Delivery Time: | 5-8DAS |
| Payment Terms: | L/C / T/T / Western Union / Paypal |
| Supply Ability: | 30000SQ.M/PER MONTH |
| Base Material: | Aluminum Substrate | Count Layer: | Single Layer |
|---|---|---|---|
| Copper Thickness: | 2 / 2 OZ In All Layer | Finish Board Thickness: | 1.60mm |
| Solder Mask: | White | Surface Finishing: | HASL Lead Free |
| High Light: | led tube light circuit pcb,custom led pcb |
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Aluminum Substrate LED light PCB with with solder mask for Tri - Proof Purification Lamp
Key Specifications/Special Features:
| Base material : | Aluminum Substrate |
| Copper thickness : | 2 oz in all layer |
| Board thickness : | 1.6 mm |
| Min. hole size : | 0.25mm |
| Min. line width : | 8 mils |
| Min. line spacing : | 8 mils |
| Surface finishing : | lead free HAL |
| Application : | Tri-proof Lamp Purification Lamp |
| Thermal Conductivity : | 2.50w/m·k |
| Board thickness tolerance : | ±10% |
| Twist& wrap : | ≤ 0.5% |
| Certificate : | RoHS, ISO 9001, UL |
| Support : | OEM |
Full range of testing services:
▪ AOI, function testing, In circuit testing, X-ray for BGA testing
▪ 3D paste thickness test
▪ Flash testing and earth bonding tests can also be undertaken where required
▪ Using our X-ray machine, we test PCBs to component level and all wiring is fully inspected and tested
▪ Each board is carefully examined by our dedicated inspection team using AOI and high magnification viewers
Products Application:
1, Consumer Electronics: TV, DVD,Digital Caramer, air conditoner, Refrigerator,set-top box etc;
2, Security monitor: Moible phone, PDA, GPS, caramer monitor etc;
3, Telecom Communication :wireless LAN card, XDSL router,Servers, Optical Device,Hard Drive etc;
4, Industrial controls: Medical device ,UPS equipment, Control device etc;
5, Vehicle Electronices: Car etc;
6, Military & Defense : Military Weapons etc;
Tecjnology Capability:
| Item | Technical Parameters |
| Layers | 1-28 Layers |
| Inner Layer Min Trace/Space | 4/4 mil |
| Out Layer Min Trace,Space | 4/4 mil |
| Inner Layer Max Copper | 4 OZ |
| Out Layer Max Copper | 4 OZ |
| Inner Layer Min Copper | 1/3 oz |
| Out Layer Min Copper | 1/3 oz |
| Min hole size | 0.15 mm |
| Max.board thickness | 6 mm |
| Min.board thickness | 0.2mm |
| Max.board size | 680*1200 mm |
| PTH Tolerance | +/-0.075mm |
| NPTH Tolerance | +/-0.05mm |
| Countersink Tolerance | +/-0.15mm |
| Board Thickness Tolerance | +/-10% |
| Min BGA | 7mil |
| Min SMT | 7*10 mil |
| Solder mask bridge | 4 mil |
| Solder mask color | White,black,blue,green,yellow,red,etc |
| Legend color | White,black,yellow,gray,etc |
| Surface finish | HAL,OSP, Immersion Ni/Au ,Imm silver/SN,ENIG |
| Board materials | FR-4;high TG;HighCTI; halogen free; Aluminum Bsed PCB,high frequency(rogers,isola),copper -base PCB |
| Impedance control | +/-10% |
| Bow and twist | ≤0.5 |
FAQ:
1. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process
2. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
3. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
4. How many types of surface finish ACCPCB can do?
the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.
Any further question, welcome to contact us by sending your inquiries
Contact Person: sales
Tel: +8615889494185
