Name: Professional Fast Quick Turn Prototype PCB Fabrication KB FR4 2.0mm board thickness
Brand: ACCPCB
SKU: S1021

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Professional Fast Quick Turn Prototype PCB Fabrication KB FR4 2.0mm board thickness

Product Details:

Place of Origin:	China
Brand Name:	ACCPCB
Certification:	ISO,SGS,TS16949
Model Number:	S1021

Payment & Shipping Terms:

Minimum Order Quantity:	1 PCS
Price:	Negotiable
Packaging Details:	Vacuum packing
Delivery Time:	3-5days
Payment Terms:	T/T ,Western Union,Paypal
Supply Ability:	50000SQ.M/Per Month

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Detailed Product Description

Material:	KB FR4	Count:	Four Layer
Surface Finish:	Gold Flash	Usage:	Water Meter
Solder Mask:	Green	Copper Thickness:	1.5 Oz All Layer
Board Thickness:	1.6mm	Min. Hole Size:	0.1mm
Min. Line Spacing:	0.1mm4mil)	Min. Line Width:	4mil
High Light:	quick turn pcb , electronic prototype board

Professional Fast Quick Turn Prototype PCB Fabrication KB FR4 2.0mm board thickness

Production description :

this board is 4layer with 1.5oz copper thickness. it is used on high voltage equipment. PCB prototype,small volum, middle and large volume are accepted. no MOQ request for new boards. for repeat order, just meet 3sq.m.

Key Specifications/Special Features:

Number of layers:	Mulity Layer / Four layer
Base material:	KB FR4
Copper thickness:	1.5 oz Cu in all layer
Thickness:	1.60 mm
Size:	150 x 90 mm
Cooper In holes:	min 20um
Surface finishing:	Gold Flash
Solder mask:	LPI solder mask, peelable solder mask
Solder mask:	Green
Working panel size :	max:1200mmX600mm (47'' X24'')
Outline profile:	Punching, Routing , CNC routing + V-cut
Certificate :	UL, CQC, TS16949, ISO14000, ROHS
Silkscreen color :	White
Twist and Bow :	no more than 0.75 %

PCB Flow Chart.pdf

Rigid PCB Technical Capability:

Items	Technical Capability
Layers	1-28 layers	Min. line width/space	4mil
Max.board size (single&doule sided)	600*1200mm	Min.annular ring width: vias	3mil
Surface finish	HAL lead free,gold flash Immersion silver,Immersion gold ,Immersion Sn, hard gold,OSP,ect	Min.board thickness(multilayer)	4layers:0.4mm; 6layers:0.6mm; 8layers:1.0mm; 10layers:1.20mm
Board materials	FR-4; high Tg; high CTI; halogen free; high frequency(rogers,taconic, PTFE,nelcon, ISOLA,polyclad 370 HR); heavy copper, Metal base clade laminate	Plating thickness (Technique: Immersion Ni/Au)	Plating type: Imm Ni, Min./Max thickness:100/150U'' Plating type: Imm Au, Min./Max thickness:2/4U''
Impedance control	± 10%	Distance between line to board edge	Outline: 0.2mm V-CUT: 0.4mm
Base copper thickness(Inner and outer layer)	Min. thickness: 0.5 OZ Max.thickness: 6OZ	Min.hole size(board thickness ≥2mm)	Aspect ratio≤16
Finished copper thickness	Outer layers: Min.thickness 1 OZ, Max.thickness 10 OZ Inner layers: Min.thickness :0.5OZ, Max.thickness : 6 OZ	Max.board thickness(single&doule sided)	3.20mm

Products Application:

Our products are widely used in meter, medical, solar energy, mobile, communication, industrial control, power electronics,security, consuming, computer, automotive, aerospace, military and so on.

Professional Fast Quick Turn Prototype PCB Fabrication KB FR4 2.0mm board thickness 0

FAQ:
1. What kinds of boards can ACCPCB process?

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.

3. What data are needed for PCB production?

PCB Gerber files with RS-274-X format.

4. What’s the typical process flow for multi-layer PCB?

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.

5. How do ACCPCB ensure quality?

Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process