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Interconnect Hdi Printed Circuit Boards High Density Precision for Artificial intelligence equipment

Interconnect Hdi Printed Circuit Boards High Density Precision for Artificial intelligence equipment

    • Interconnect Hdi Printed Circuit Boards High Density Precision for Artificial intelligence equipment
    • Interconnect Hdi Printed Circuit Boards High Density Precision for Artificial intelligence equipment
  • Interconnect Hdi Printed Circuit Boards High Density Precision for Artificial intelligence equipment

    Product Details:

    Place of Origin: China
    Brand Name: ACCPCB
    Certification: ISO, UL, SGS,TS16949
    Model Number: P1147

    Payment & Shipping Terms:

    Minimum Order Quantity: 1 PCS
    Price: Negotiable
    Packaging Details: Vacuum packing with desiccant
    Delivery Time: 15-20days
    Payment Terms: L/C / T/T / Western Union / Paypal
    Supply Ability: 25000SQ.M/PER MONTH
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    Detailed Product Description
    Material: ShengyiFR4TG150 Layer: 4 Layer
    Feature: Immersion Tin Copper Thickness: 2oz Inner Layer / 2.5oz Outlayer
    Board Thickness: 1.20MM

    Interconnect Hdi Printed Circuit Boards High Density Precision for Artificial intelligence equipment

     

    Key Specifications/Special Features:

     

    Number of layers : 4layer
    Base-material : Shengyi FR4TG150
    Thickness : 1.20 mm+/-10%
    Final-Cu : 70um
    Blind and buried via : Yes
    Min. Drill hole : 0.4mm
    Min. Line space : 0.6mm
    Min. Line width : 0.6mm
    Mech. treatment : Routing +v-cuting
    Surface treatment : Immersion tin
    Solder-mask : Red
    Legend-Print : white
    100% E-test : Yes


     
    Lead Time:

    Types

     

    (Max ㎡/month)

    Samples

    (days)

    Mass Production(days)
    New PO Repeat PO Urgent
    2layer 50000 sq.m/month 2-3 10-11 8-9 4
    4layer 5-6 11-12 9-11 5
    6layer 6-7 13-14 12-14 6
    8layer 7-8 16-18 14-15 7

     
     

    Main Export Markets:

    • Asia : Main 2-8layer
    • Australasia : 2--10layer
    • North America : 4layer over
    • Western Europe : 4--12layer

     
    Advantages :


    •  Strict product liability, taking IPC-A-160 standard
    •  Engineering pretreatment before production
    •  Production process control (5Ms)
    •  100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
    •  100% AOI inspection, including X-ray, 3D microscope and ICT
    •  High-voltage test, impedance control test
    •  Micro section, soldering capacity, thermal stress test, shocking test
    •  In-house PCB production
    •  No minimum order quantity and free sample
    •  Focus on low to medium volume production
    •  Quick and on-time delivery 

     

     

     

    FAQ

     

    1. How do ACCPCB ensure quality?

     

    Our high quality standard is achieved with the following.

    1.1 The process is strictly controlled under ISO 9001:2008 standards.
    1.2 Extensive use of software in managing the production process
    1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
    1.4.Dedicated quality assurance team with failure case analysis process

    2. What kinds of boards can ACCPCB process?

     

    Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


    3. What data are needed for PCB production?

     

    PCB Gerber files with RS-274-X format.


    4. What’s the typical process flow for multi-layer PCB?

     

    Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


    5. How many types of surface finish ACCPCB can do?

     

    O-the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.


    6. What are the main factors which will affect the price of PCB?

     

    Material;
    Surface finish;

    Board thickness, Copper thickness;
    Technology difficulty;
    Different quality criteria;
    PCB characteristics;
    Payment terms;

     

    7. How to you make the impedance calculation?

     

    The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment.

     

     

    Interconnect Hdi Printed Circuit Boards High Density Precision for Artificial intelligence equipment

     

    Contact Details
    Accuracy Electronics Technologies Co.,Ltd

    Contact Person: sales

    Send your inquiry directly to us (0 / 3000)