Name: 6 mil 3 Layer Immersion Gold Multi Layer Circuit Board For UPS Device
Brand: ACCPCB
SKU: S1021342

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6 mil 3 Layer Immersion Gold Multi Layer Circuit Board For UPS Device

Product Details:

Place of Origin:	China
Brand Name:	ACCPCB
Certification:	ISO,SGS,TS16949
Model Number:	S1021342

Payment & Shipping Terms:

Minimum Order Quantity:	1 PCS
Price:	Negotiable
Packaging Details:	Vacuum packing
Delivery Time:	3-5days
Payment Terms:	T/T ,Western Union,Paypal
Supply Ability:	50000SQ.M/Per Month

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Detailed Product Description

Material:	KB FR4	Count:	3layer
Surface Finish:	Immersion Gold	Application:	UPS Device
Solder Mask:	Green	Copper Thickness:	3oz All Layer
Min. Hole Size:	8 Mil/6 Mil	Min. Line Spacing:	4mil
Min. Line Width:	4mil	Service:	Customized PCB
High Light:	Immersion Gold Multi Layer Circuit Board , 3oz Multi Layer Circuit Board , 6 mil Multi Layer Circuit Board

6 mil 3 Layer Immersion Gold Multi Layer Circuit Board For UPS Device

Production description :

this board is 3 layer with 3 oz copper thickness. it is used for UPS device. PCB prototype,samll volum, middle and large volume are accepted. no MOQ request for new order. all of these boards are met UL,TS16949, ISO9001 Etc.

PCB Flow Chart.pdf

Key Specifications of high frequency board :

Production Types:	Multilayer board
Layer :	3layer
Base Material :	FR4
Copper Thickness :	3oz
Board Thickness :	1.4mm
Min. Finish Hole Size :	8 mil (0.20mm)
Min. Line Width :	4 mil
Min. Line Spacing :	4 mil
Surface Finishing :	Immersion gold
Drilling hole tolerance:	+/-3 mil ( 0.075mm )
Min Outline tolerance :	+/-4 mil ( 0.10mm )
Working panel size :	max:1200mmX600mm (47'' X24'')
Outline profile:	Punching, Routing , CNC routing + V-cut
Solder mask :	LPI Solder mask, Peelable mask
Solder Mask Color :	Blue, black,yellow, matte green
Certificate :	UL, CQC, TS16949, ISO14000, ROHS
Silkscreen color :	White
Twist and Bow :	no more than 0.75 %

ACCPCB Technical Capability.pdf

Products Application:

1, Security monitor: Moible phone, PDA, GPS, caramer monitor etc;

2, Telecom Communication :wireless LAN card, XDSL router,Servers, Optical Device,Hard Drive etc;

3, Consumer Electronics: TV, DVD,Digital Caramer, air conditoner, Refrigerator,set-top box etc;

4, Vehicle Electronices: Car etc;

5, Industrial controls: Medical device ,UPS equipment, Control device etc;

6, Military & Defense : Military Weapons etc;

Technology Capability:

Item	Technical Parameters
Layers	1-28 Layers
Inner Layer Min Trace/Space	4/4 mil
Out Layer Min Trace,Space	4/4 mil
Inner Layer Max Copper	4 OZ
Out Layer Max Copper	4 OZ
Inner Layer Min Copper	1/3 oz
Out Layer Min Copper	1/3 oz
Min hole size	0.15 mm
Max.board thickness	6 mm
Min.board thickness	0.2mm
Max.board size	680*1200 mm
PTH Tolerance	+/-0.075mm
NPTH Tolerance	+/-0.05mm
Countersink Tolerance	+/-0.15mm
Board Thickness Tolerance	+/-10%
Min BGA	7mil
Min SMT	7*10 mil
Solder mask bridge	4 mil
Solder mask color	White,black,blue,green,yellow,red,etc
Legend color	White,black,yellow,gray,etc
Surface finish	HAL,OSP, Immersion Ni/Au ,Imm silver/SN,ENIG
Board materials	FR-4;high TG;HighCTI; halogen free; Aluminum Bsed PCB,high frequency(rogers,isola),copper -base PCB
Impedance control	+/-10%
Bow and twist	≤0.5