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Heavy Copper PCB 3.0 Mm Board Thickness Black Solder Mask for Power Amplifier

Heavy Copper PCB 3.0 Mm Board Thickness Black Solder Mask for Power Amplifier

Heavy Copper PCB 3.0 Mm Board Thickness Black Solder Mask for Power Amplifier
Heavy Copper PCB 3.0 Mm Board Thickness Black Solder Mask for Power Amplifier
Heavy Copper PCB 3.0 Mm Board Thickness Black Solder Mask for Power Amplifier
Product Details:
Place of Origin: China
Brand Name: ACCPCB
Certification: ISO, UL, SGS,TS16949
Model Number: P1029
Payment & Shipping Terms:
Minimum Order Quantity: 1 PCS
Price: Negotiable
Packaging Details: Vacuum packing with desiccant
Delivery Time: 10-15days
Payment Terms: L/C, T/T, Western Union,Paypal
Supply Ability: 30000SQ.M/Per Month
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Detailed Product Description
Material: FR4 Application: Power Amplifier
Cooper Thickness: 3 Oz Each Layer Board Thickness: 3.0mm
Surface Finish: Immersion Gold Feature: Rigid Circuit Boards
High Light:

copper base pcb

,

copper clad circuit board

Heavy Copper PCB 3.0 Mm Board Thickness Black Solder Mask for Power Amplifier

 

Key Specifications/Special Features:

Layer : 4 Layers

Base Material :  FR4 tg150
Copper Thickness :  3  oz in all layer
Board Thickness :  3.0 mm
Min. Hole Size : 6 mil / 0. 15mm
Min. Line Width : 4 / 4 mil 
Min. Line Spacing : 4 / 4 mil
Surface Finishing : Immersion gold ( au :2micron)

Fire-proof level : 94v0

Solder mask : Black

Certificate : UL, CQC, TS16949, ISO14000, ROHS

 

ACCPCB Technical Capability.pdf

 

Quality Goal:

Category Performance indicator Quality Goal

Delivery

Customer service rate 99.9%
Semi Finished product Process inspection pass rate 100%
Finished product FQA Rebate rate 0.1%
Scrapped 1L scrap rate 0.5%
2L scrap rate 1%
Multi Layer scrap rate 2%
Customers Customer complaint rate 0.8%
Customer return rate 0.5%
Customer satisfaction 99%

 

 

Quality assurance : 

Every production process has a special person to test to ensure quality, AOI, E-testing, Flying Probe Test.
Have professional engineers to check the quality
All products have passed CE, FCC, ROHS and other certifications

 

 

Product Application Field :

Heavy Copper PCB 3.0 Mm Board Thickness Black Solder Mask for Power Amplifier 0 

 

 

FAQ:

1. How do ACCPCB ensure quality?

  Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?

   Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


3. What data are needed for PCB production?

  PCB Gerber files with RS-274-X format.


4. What’s the typical process flow for multi-layer PCB?

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


5. How many types of surface finish ACCPCB can do?

   the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.


6. What are the main factors which will affect the price of PCB?

Material;
Surface finish;

Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;

 

 

Heavy Copper PCB 3.0 Mm Board Thickness Black Solder Mask for Power Amplifier 1

 

Contact Details
Accuracy Electronics Technologies Co.,Ltd

Contact Person: sales

Tel: +8615889494185

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