2OZ copper pcb Heavy Copper PCB 8 Layers Design OEM Electronic Integration Solution

2OZ copper pcb Heavy Copper PCB 8 Layers Design OEM Electronic Integration Solution

Key Specifications/Special Features:

Layer: 8layer

Base Material : KB FR4
Copper Thickness :  2oz in all layer
Board Thickness :  2.40 mm
Min. Hole Size : 8 mil / 0. 2mm
Min. Line Width : 6 / 6 mil 
Min. Line Spacing : 6 / 6 mil
Surface Finishing : Immersion gold

Fire-proof level : 94v0

Solder mask : Green

Certificate : UL, CQC, TS16949, ISO14000, ROHS

Quality Goal:

Quality assurance : 

Every production process has a special person to test to ensure quality, AOI, E-testing, Flying Probe Test.
Have professional engineers to check the quality
All products have passed CE, FCC, ROHS and other certifications

Product Application Field :

FAQ :

1. How do ACCPCB ensure quality?

    Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?

   Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.

3. What data are needed for PCB production?

   PCB Gerber files with RS-274-X format.

4. What’s the typical process flow for multi-layer PCB?

   Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.

5. How many types of surface finish ACCPCB can do?

   the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.

6. What are the main factors which will affect the price of PCB?

   Material;
   Surface finish;

   Board thickness, Copper thickness;
   Technology difficulty;
   Different quality criteria;
   PCB characteristics;
   Payment terms;

7. How to you make the impedance calculation?

   The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment.