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4 Layer KB FR4 Tg170 1.0mm Communication PCB Manufacturing Service

4 Layer KB FR4 Tg170 1.0mm Communication PCB Manufacturing Service

4 Layer KB FR4 Tg170 1.0mm Communication PCB Manufacturing Service
4 Layer KB FR4 Tg170 1.0mm Communication PCB Manufacturing Service
4 Layer KB FR4 Tg170 1.0mm Communication PCB Manufacturing Service
Product Details:
Place of Origin: China
Brand Name: ACCPCB
Certification: ISO, UL, SGS,TS16949
Model Number: P111616
Payment & Shipping Terms:
Minimum Order Quantity: 10PCS
Price: Negotiable
Packaging Details: Vacuum packing with desiccant
Delivery Time: 10-12days
Payment Terms: L/C / T/T / Western Union / Paypal
Supply Ability: 30,000SQ.M/Per Month
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Detailed Product Description
Material: FR4 Tg170 Thickness: 1.0mm
Surface Finish: OSP Layer: 4L
Copper Thicknes:: 10Z PCB Standard: IPC-A-610 D
Type: Customized PCB Min Holes Size: 4mil
Min. Line Width: 4mil Min Copper Thicness: 20um
Solder Mask Color: Green,yellow, Red, Black Etc. Application: Server Equipment
High Light:

1.0mm Communication PCB

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Tg170 PCB Manufacturing Service

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FR4 Communication PCB Manufacturing Service

4 Layer KB FR4 Tg170 1.0mm Communication PCB Manufacturing Service

 

 

Production description :

 

this board is 4 layer with 1.0 mm thickness. it is used for WIFI antenna. PCB prototype,small volum, middle and large volume are accepted. no MOQ request for new boards. for repeat order, just meet 3sq.m.

 

 

Key Specifications of High Voltage  PCB:

 

Production Types:  Rigid PCB

Layer :

 4Layers
Base Material :  FR4 tg170
Copper Thickness : 1oz
Board Thickness :  1.0mm
Min. Finish Hole Size :  8 mil  (0.10mm)
Min. Line Width :  4 mil
Min. Line Spacing :  4 mil
Surface Finishing : OSP
Drilling hole tolerance: +/-3 mil    (  0.075mm )
Min Outline tolerance : +/-4 mil    (  0.10mm )
Working panel size :  max:1200mmX600mm (47'' X24'')
Outline profile: Punching, Routing , CNC routing + V-cut
Solder mask : LPI Solder mask, Peelable mask
Solder Mask Color : Blue, black,yellow, matte green
Certificate : UL, CQC, TS16949, ISO14000, ROHS
Silkscreen color : White
Twist and Bow :  no more than 0.75 %

 

PCB Flow Chart.pdf

 

Rigid PCB Technical Capability:

 

 Items                                      Technical Capability
Layers 1-28 layers Min. line width/space 4mil

Max.board size (single&doule

sided)

600*1200mm Min.annular ring width: vias 3mil
Surface finish

HAL lead free,gold flash

Immersion silver,Immersion gold ,Immersion Sn,

hard gold,OSP,ect

Min.board thickness(multilayer) 4layers:0.4mm;
6layers:0.6mm;
8layers:1.0mm;
10layers:1.20mm
Board materials

FR-4; high Tg; high CTI; halogen free; high frequency(rogers,taconic,

PTFE,nelcon,

ISOLA,polyclad 370 HR); heavy copper,

Metal base clade laminate

Plating thickness (Technique:

Immersion Ni/Au)

Plating type: Imm Ni, Min./Max thickness:100/150U'' Plating type: Imm Au, Min./Max thickness:2/4U''
Impedance control ± 10%

Distance between

line to board edge

Outline: 0.2mm

V-CUT: 0.4mm

Base copper thickness(Inner

and outer layer)

Min. thickness: 0.5 OZ Max.thickness: 6OZ Min.hole size(board thickness ≥2mm) Aspect ratio≤16
Finished copper thickness Outer layers:
Min.thickness 1 OZ,
Max.thickness 10 OZ
Inner layers:
Min.thickness :0.5OZ,
Max.thickness : 6 OZ
Max.board thickness(single&doule sided) 3.20mm

 

 

 

Products Application:

 

Our products are widely used in meter, medical, solar energy, mobile, communication, industrial control, power electronics,security, consum electronics, computer, automotive, aerospace, military and so on.

 

 


4 Layer KB FR4 Tg170 1.0mm Communication PCB Manufacturing Service 0
 

FAQ :

 


1. What’s the typical process flow for multi-layer PCB?

 

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


2. How many types of surface finish ACCPCB can do?

 

ACCPCB has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.

 


3. What data are needed for PCB production?

 

PCB Gerber files with RS-274-X format.

 

 

 

4. How many types of surface finish ACCPCB can do?

 

O-the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.


 

Contact Details
Accuracy Electronics Technologies Co.,Ltd

Contact Person: sales

Tel: +8615889494185

Send your inquiry directly to us (0 / 3000)