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Wireless Device Rigid Communication PCB With Immersion Gold Surface Finishing

Wireless Device Rigid Communication PCB With Immersion Gold Surface Finishing

Wireless Device Rigid Communication PCB With Immersion Gold Surface Finishing
Wireless Device Rigid Communication PCB With Immersion Gold Surface Finishing
Wireless Device Rigid Communication PCB With Immersion Gold Surface Finishing
Product Details:
Place of Origin: China
Brand Name: ACCPCB
Certification: ISO, UL, SGS,TS16949
Model Number: P1038
Payment & Shipping Terms:
Minimum Order Quantity: 1 PCS
Price: Negotiable
Packaging Details: Vacuum packing with desiccant
Delivery Time: 10-15days
Payment Terms: L/C, T/T, Western Union,Paypal
Supply Ability: 30000SQ.M/Per Month
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Detailed Product Description
Material: FR4 Application: Wireless Device
Cooper Thickness: 2 Oz Outlayer / 1 Oz Inner Layer Board Thickness: 1.20mm
Surface Finish: Immersion Gold Feature: Rigid Circuit Boards
High Light:

Rigid Communication PCB

,

Immersion gold Communication PCB

,

Immersion Gold 6 Layer PCB

Wireless Device Rigid Communication PCB With Immersion Gold Surface Finishing

 

Key Specifications/Special Features:

Layer : 6 Layers

Base Material : FR4 
Copper Thickness :  2 / 1 / 1 / 2oz,
Board Thickness :  1.20 mm
Min. Hole Size : 6 mil / 0.15 mm
Min. Line Width : 4 / 4 mil 
Min. Line Spacing : 4 / 4 mil
Surface Finishing : Immersion gold

Fire-proof level : 94v0

Certificate : UL, CQC, TS16949, ISO14000, ROHS

 

Rigid PCB Technical Capability:

Items Technical Capability
Layers 1-28 layers Min. line width/space 4mil

Max.board size (single&doule

sided)

600*1200mm Min.annular ring width: vias 3mil
Surface finish

HAL lead free,gold flash

Immersion silver,Immersion gold ,Immersion Sn,

hard gold,OSP,ect

Min.board thickness(multilayer) 4layers:0.4mm;
6layers:0.6mm;
8layers:1.0mm;
10layers:1.20mm
Board materials

FR-4; high Tg; high CTI; halogen free; high frequency(rogers,taconic,

PTFE,nelcon,

ISOLA,polyclad 370 HR); heavy copper,

Metal base clade laminate

Plating thickness (Technique:

Immersion Ni/Au)

Plating type: Imm Ni, Min./Max thickness:100/150U'' Plating type: Imm Au, Min./Max thickness:2/4U''
Impedance control ± 10%

Distance between

line to board edge

Outline: 0.2mm

V-CUT: 0.4mm

Base copper thickness(Inner

and outer layer)

Min. thickness: 0.5 OZ Max.thickness: 6OZ Min.hole size(board thickness ≥2mm) Aspect ratio≤16
Finished copper thickness Outer layers:
Min.thickness 1 OZ,
Max.thickness 10 OZ
Inner layers:
Min.thickness :0.5OZ,
Max.thickness : 6 OZ
Max.board thickness(single&doule sided) 3.20mm

 

 

Quality Goal:

 

Category Performance indicator Quality Goal

Delivery

Customer service rate 99.9%
Semi Finished product Process inspection pass rate 100%
Finished product FQA Rebate rate 0.1%
Scrapped 1L scrap rate 0.5%
2L scrap rate 1%
Multi Layer scrap rate 2%
Customers Customer complaint rate 0.8%
Customer return rate 0.5%
Customer satisfaction 99%

 

 

Quality assurance : 

 

Every production process has a special person to test to ensure quality, AOI, E-testing, Flying Probe Test.
Have professional engineers to check the quality
All products have passed CE, FCC, ROHS and other certifications

 

 

Product Application Field :

Wireless Device Rigid Communication PCB With Immersion Gold Surface Finishing 0 

 

FAQ:

1. What data are needed for PCB production?

PCB Gerber files with RS-274-X format.

2. How do ACCPCB ensure quality? 

   Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

3. What kinds of boards can ACCPCB process?

   Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


4. What’s the typical process flow for multi-layer PCB?

  Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


5. How many types of surface finish ACCPCB can do?

   the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.

 

 

Wireless Device Rigid Communication PCB With Immersion Gold Surface Finishing 1

Contact Details
Accuracy Electronics Technologies Co.,Ltd

Contact Person: sales

Tel: +8615889494185

Send your inquiry directly to us (0 / 3000)