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| Place of Origin: | China |
| Brand Name: | ACCPCB |
| Certification: | ISO,UL,SGS,TS16949,ROHS |
| Model Number: | P1227 |
| Minimum Order Quantity: | 1 PCS |
|---|---|
| Price: | Negotiable |
| Packaging Details: | Vacuum Packing With Desiccant |
| Delivery Time: | 6-10days |
| Payment Terms: | T/T / Western Union / Paypal |
| Supply Ability: | 35,000SQ.M/Per Month |
| Layer Count: | 8 Layer | Finish Thickness: | 1.2±10%mm |
|---|---|---|---|
| Minimum Via Dia: | 0.1mm | Holes Feature: | Laser Dril |
| Surface Finish: | Immersion Gold | Material: | KB FR4 |
| High Light: | pwb printed wiring board,pwb assembly |
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| Layer count : |
8 layer |
| Finish thickness: |
1.2 ±10%mm |
| Minimum width/spacing: | 0.1/0.1mm |
|
Minimum via dia : |
0.1mm |
| Surface finish: |
ENIG |
| Specialty: |
L1-2, L2-3, L4-5 |
| L2-5: | Buried vias resin filled |
| L1: |
differential impedance of 100±9Ω |
| Outline: | Routing,V-Groove, Beveling punch |
| Company type: | Manufacturer/ Factory |
PCB Assembly capability and services:
1) Professional Surface-mounting and Through-hole soldering Technology
2) Various sizes like 1206,0805,0603,0402,0201components SMT technology
3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
4) PCB Assembly With UL,CE,FCC,Rohs Approval
5) Nitrogen gas reflow soldering technology for SMT.
6) High Standard SMT&Solder Assembly Line
7) High density interconnected board placement technology capacity.
Here is our PCB order capability:
FOB Port : Hong Kong / Shenzhen
Lead Time : 6-10 days
HTS Code : 8534.00.10
Dimensions Per Carton : 37X27X22 cm
Weight Per Carton : 20 Kilograms
FAQ :
1. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process
2. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
3. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
4. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.
5. How many types of surface finish ACCPCB can do?
O-the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.
6. What are the main factors which will affect the price of PCB?
Material;
Surface finish;
Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;
7. How to you make the impedance calculation?
The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment.
Contact Person: sales
