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8layer electronics HDI Board with immersion gold and Green Color High Performance

8layer electronics HDI Board with immersion gold and Green Color High Performance

8layer electronics HDI Board with immersion gold and  Green Color High Performance
8layer electronics HDI Board with immersion gold and  Green Color High Performance
8layer electronics HDI Board with immersion gold and  Green Color High Performance
Product Details:
Place of Origin: China
Brand Name: ACCPCB
Certification: ISO, UL, SGS,TS16949
Model Number: P11378
Payment & Shipping Terms:
Minimum Order Quantity: 1 PCS
Price: Negotiable
Packaging Details: Vacuum packing with desiccant
Delivery Time: 15-20days
Payment Terms: L/C / T/T / Western Union / Paypal
Supply Ability: 25000SQ.M/PER MONTH
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Detailed Product Description
Key Words: High Density Interconnector Material: FR4 TG180
Layer: 8-layer PCB With 2+4+2 HDI Structure Feature: HAL Lead Free
Copper Thickness: 1.5oz Inner Layer / 2oz Outlayer Board Thickness: 0.2-6.0mm
Min. Line Spacing: 0.1mm Min. Line Width: 0.1 0mm
Min. Hole Size: 0.1mm Solder Mask Color: Green
High Light:

high density interconnect pcb

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hdi circuit boards

8layer electronics HDI Board with immersion gold and Green Color High Performance
 

Production Description:

It is 8L with blinded and buired vias board. it is used for wifi mobile phone. all of PCB have UL, CE , ROHS, TS16949 Certification. no MOQ request for new orders.

PCB Flow Chart.pdf

 

Production Features of HDI boards :

Number of layers: 8layer
Base material: FR4tg180
Copper thickness: 1.5 oz Cu in iner layer, 2oz outlayer
Thickness: 1.8 mm
Size: 200 x 100 mm
Cooper In holes: min 20um
Surface finishing: immerison gold
Min. Hole Size : 4 mil, 0.1mm
Legends: White
Outline profile: Routing,V-Groove, Beveling punch
BGA pad size : : 0.3mm
Solder mask : LPI Solder mask, Peelable mask
Specialty : : L1-2, L2-3, L6-7, L7-8, laser blind via of 0.1mm, L2-7 buried via of 0.2mmAll laser blind via are filled by plating
Twist and Bow : no more than 0.75 %
Certificate : UL, CQC, TS16949, ISO14000, ROHS
Line width/space: 5.0 / 5.0mil
Application : wifi phone

 

Technology Capability:

Item Technical Parameters
Layers 1-28 Layers
Inner Layer Min Trace/Space 4/4 mil
Out Layer Min Trace,Space 4/4 mil
Inner Layer Max Copper 4 OZ
Out Layer Max Copper 4 OZ
Inner Layer Min Copper 1/3 oz
Out Layer Min Copper 1/3 oz
Min hole size 0.15 mm
Max.board thickness 6 mm
Min.board thickness 0.2mm
Max.board size 680*1200 mm
PTH Tolerance +/-0.075mm
NPTH Tolerance +/-0.05mm
Countersink Tolerance +/-0.15mm
Board Thickness Tolerance +/-10%
Min BGA 7mil
Min SMT 7*10 mil
Solder mask bridge 4 mil
Solder mask color White,black,blue,green,yellow,red,etc
Legend color White,black,yellow,gray,etc
Surface finish HAL,OSP, Immersion Ni/Au ,Imm silver/SN,ENIG
Board materials FR-4;high TG;HighCTI; halogen free; Aluminum Bsed PCB,high frequency(rogers,isola),copper -base PCB
Impedance control +/-10%
Bow and twist ≤0.5

 

Products Application:

1, Security monitor: Moible phone, PDA, GPS, caramer monitor etc;

2, Telecom Communication :wireless LAN card, XDSL router,Servers, Optical Device,Hard Drive etc;

3, Consumer Electronics: TV, DVD,Digital Caramer, air conditoner, Refrigerator,set-top box etc;

4, Vehicle Electronices: Car etc;

5, Industrial controls: Medical device ,UPS equipment, Control device etc;

6, Military & Defense : Military Weapons etc;

 

Lead Time:

Types

 

(Max ㎡/month)

Samples

(days)

Mass Production(days)
New PO Repeat PO Urgent
2layer 50000 sq.m/month 2-3 10-11 8-9 4
4layer 5-6 11-12 9-11 5
6layer 6-7 13-14 12-14 6
8layer 7-8 16-18 14-15 7

 


Advantages :
•  Strict product liability, taking IPC-A-160 standard
•  Engineering pretreatment before production
•  Production process control (5Ms)
•  100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
•  100% AOI inspection, including X-ray, 3D microscope and ICT
•  High-voltage test, impedance control test
•  Micro section, soldering capacity, thermal stress test, shocking test
•  In-house PCB production
•  No minimum order quantity and free sample
•  Focus on low to medium volume production
•  Quick and on-time delivery 

 

8layer electronics HDI Board with immersion gold and  Green Color High Performance 0

 

FAQ:

1. How do ACCPCB ensure quality?

  Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?

  Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


3. What data are needed for PCB production?

   PCB Gerber files with RS-274-X format.


4. What’s the typical process flow for multi-layer PCB?

   Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


5. How many types of surface finish ACCPCB can do?

   the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.

 

 

 

 

 

Contact Details
Accuracy Electronics Technologies Co.,Ltd

Contact Person: sales

Tel: +8615889494185

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