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four layer pcb Frequency PCB with Impedance Control and Immersion Gold surface finishing

four layer pcb Frequency PCB with Impedance Control and Immersion Gold surface finishing

four layer pcb Frequency PCB with Impedance Control and Immersion Gold surface finishing
four layer pcb Frequency PCB with Impedance Control and Immersion Gold surface finishing
four layer pcb Frequency PCB with Impedance Control and Immersion Gold surface finishing
Product Details:
Place of Origin: China
Brand Name: ACCPCB
Certification: ISO, UL, SGS,TS16949
Model Number: P1118
Payment & Shipping Terms:
Minimum Order Quantity: 10PCS
Price: Negotiable
Packaging Details: Vacuum packing with desiccant
Delivery Time: 10-12days
Payment Terms: L/C / T/T / Western Union / Paypal
Supply Ability: 30,000SQ.M/Per Month
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Detailed Product Description
Material: FR4 Thickness: 1.20mm
Surface Finish: ENIG Layer: 4L
Pcb Standard: IPC-A-610 D Usage: OEM Electronics
High Light:

green pcb board

,

immersion gold pcb

four layer pcb Frequency PCB with Impedance Control and Immersion Gold surface finishing

 

Key Specifications/Special Features :

Layer : 4Layers
Base Material : FR4
Copper Thickness : 1oz for all layer
Board Thickness : 1.20mm
Min. Hole Size : 6 mil, 0.15mm
Min. Line Width : 4/4 mil, 0.1 / 0.1 mm
Min. Line Spacing : 4/4mil, 0.1 / 0.1 mm
Surface Finishing : ENIG
Solder Mask Color : Green
Certificate : UL, CQC, TS16949, ISO14000, ROHS
Silkscreen color : White
Outline : Routing
Company type: Manufacturer/ Factory

 

Quality assurance :

Every production process has a special person to test to ensure quality, AOI, E-testing, Flying Probe Test.

Have professional engineers to check the quality

All products have passed CE, FCC, ROHS and other certifications

 

Technology Capability:

Item Technical Parameters
Layers 1-28 Layers
Inner Layer Min Trace/Space 4/4 mil
Out Layer Min Trace,Space 4/4 mil
Inner Layer Max Copper 4 OZ
Out Layer Max Copper 4 OZ
Inner Layer Min Copper 1/3 oz
Out Layer Min Copper 1/3 oz
Min hole size 0.15 mm
Max.board thickness 6 mm
Min.board thickness 0.2mm
Max.board size 680*1200 mm
PTH Tolerance +/-0.075mm
NPTH Tolerance +/-0.05mm
Countersink Tolerance +/-0.15mm
Board Thickness Tolerance +/-10%
Min BGA 7mil
Min SMT 7*10 mil
Solder mask bridge 4 mil
Solder mask color White,black,blue,green,yellow,red,etc
Legend color White,black,yellow,gray,etc
Surface finish HAL,OSP, Immersion Ni/Au ,Imm silver/SN,ENIG
Board materials FR-4;high TG;HighCTI; halogen free; Aluminum Bsed PCB,high frequency(rogers,isola),copper -base PCB
Impedance control +/-10%
Bow and twist ≤0.5

 

 

Advantages:
• Strict product liability, taking IPC-A-160 standard
• Engineering pretreatment before production
• Production process control (5Ms)
• 100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
• 100% AOI inspection, including X-ray, 3D microscope and ICT
• High-voltage test, impedance control test
• Micro section, soldering capacity, thermal stress test, shocking test
• In-house PCB production
• No minimum order quantity and free sample
• Focus on low to medium volume production
• Quick and on-time delivery

 

Lead Time : 

Lead Time 2 /L 4 /L 6/ L 8/ L
Sample Order 3-5days 6-8days 10-12days 12-14days
Mass Production 7-9days 8-10days 12-15days 15-18day
 

FAQ :

1. How do ACCPCB ensure quality?

Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?

   Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


3. What data are needed for PCB production?

   PCB Gerber files with RS-274-X format.


4. What’s the typical process flow for multi-layer PCB?  

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


5. How many types of surface finish ACCPCB can do?

  -the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.


 

 

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Contact Details
Accuracy Electronics Technologies Co.,Ltd

Contact Person: sales

Tel: +8615889494185

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