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| Place of Origin: | China |
| Brand Name: | ACCPCB |
| Certification: | ISO,UL,SGS,TS16949,ROHS |
| Model Number: | P1221 |
| Minimum Order Quantity: | 1 PCS |
|---|---|
| Price: | Negotiable |
| Packaging Details: | Vacuum Packing With Desiccant |
| Delivery Time: | 6-10days |
| Payment Terms: | T/T / Western Union / Paypal |
| Supply Ability: | 35,000SQ.M/Per Month |
| Finish Thickness: | 1.60±10%mm | Minimum Via Dia: | 0.2mm |
|---|---|---|---|
| Surface Finish: | Immersion Gold | Material: | ITEQ FR4 |
| Application: | Medical Sphygmomanometer | Solder Mask: | Red |
| High Light: | pwb printed wiring board,pwb assembly |
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| Layer : |
up to 20 layers |
| Materials : | FR-4, FR4 High Tg/ High CTI Material |
| TG : |
130-180 |
| Surface : |
HASL LF , Immersion Gold/Silver/Tin, OSP, Gold Plated |
| Min drill size : | 0.10mm |
| Min track/spacing : |
4/4-mil |
| Buried and blind via : | 0.15MM |
| Outline : |
CNC Milling and V-cut |
| Solder mask colors : | Green, Blue, Black, White, Red and Yellow, Matte green, Matte black, Matte Blue |
| Silkscreen colors : |
black, white and yellow |
|
Impedance control |
yes |
|
Blue Peelable Mask |
yes |
| Company type: | Manufacturer/ Factory |
| Outline: | Routing,V-Groove, Beveling punch |
FOB Port : Hong Kong / Shenzhen
Lead Time : 6-10 days
HTS Code : 8534.00.10
Dimensions Per Carton : 37X27X22 cm
Weight Per Carton : 20 Kilograms
FAQ
1. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process
2. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
3. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
4. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.
5. How many types of surface finish ACCPCB can do?
O-the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.
6. What are the main factors which will affect the price of PCB?
Material;
Surface finish;
Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;
7. How to you make the impedance calculation?
The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment
Contact Person: sales
