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8 Layer HDI PCB Board High Density Interconnect With Immersion Gold Sureface

8 Layer HDI PCB Board High Density Interconnect With Immersion Gold Sureface

8 Layer HDI PCB Board High Density Interconnect With Immersion Gold Sureface
8 Layer HDI PCB Board High Density Interconnect With Immersion Gold Sureface

Product Details:

Place of Origin: China
Brand Name: ACCPCB
Certification: ISO, UL, SGS,TS16949
Model Number: P1135

Payment & Shipping Terms:

Minimum Order Quantity: 1 PCS
Price: Negotiable
Packaging Details: Vacuum packing with desiccant
Delivery Time: 15-20days
Payment Terms: L/C / T/T / Western Union / Paypal
Supply Ability: 25000SQ.M/PER MONTH
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Detailed Product Description
Key Words: High Density Interconnector Material: FR4 TG150
Layer: 8-layer PCB With 1+N+1 HDI Structure Feature: HAL Lead Free
Copper Thickness: 1oz Inner Layer / 2oz Outlayer Board Thickness: 0.2-6.0mm
Min. Line Spacing: 0.1mm Solder Mask: Green
Product Name: Fr4 Pcb Manufacturer Service: Customize
High Light:

double sided copper clad board


hdi circuit boards

8 Layer High Density Interconnect PCB Green Solder Mask with Immersion gold sureface

Production description :


this board is 8L PCB. it is used for aerospace  production. all of PCB are passed ISO9001,ROHS, UL, TS16949  certifacaion etc.



Key Specifications of tablet PCB board​ :


Production Types: Rigid PCB
Layer : 8 layer
Base Material : FR4150
Copper Thickness : 2oz
Board Thickness : 1.6mm
Min. Finish Hole Size : 8 mil (0.20mm)
Min. Line Width : 4 mil
Min. Line Spacing : 4 mil
Surface Finishing : ENIG,OSP,HASL lead free ,Immersion Gold,Gold Plating
Drilling hole tolerance: +/-3 mil ( 0.075mm )
Min Outline tolerance : +/-4 mil ( 0.10mm )
Working panel size : max:1200mmX600mm (47'' X24'')
Outline profile: Punching, Routing , CNC routing + V-cut
Solder mask : LPI Solder mask, Peelable mask
Solder Mask Color : Blue, black,yellow, matte green
Certificate : UL, CQC, TS16949, ISO14000, ROHS
Silkscreen color : White
Twist and Bow : no more than 0.75 %



PCB Flow Chart.pdf


ACCPCB Technical Capability.pdf


Lead Time:



(Max ㎡/month)



Mass Production(days)
New PO Repeat PO Urgent
2layer 50000 sq.m/month 2-3 10-11 8-9 4
4layer 5-6 11-12 9-11 5
6layer 6-7 13-14 12-14 6
8layer 7-8 16-18 14-15 7



 Advantages :

•  Strict product liability, taking IPC-A-160 standard
•  Engineering pretreatment before production
•  Production process control (5Ms)
•  100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
•  100% AOI inspection, including X-ray, 3D microscope and ICT
•  High-voltage test, impedance control test
•  Micro section, soldering capacity, thermal stress test, shocking test
•  In-house PCB production
•  No minimum order quantity and free sample
•  Focus on low to medium volume production
•  Quick and on-time delivery 



8 Layer HDI PCB Board High Density Interconnect With Immersion Gold Sureface 0




1. How do ACCPCB ensure quality?


Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?


Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.

3. What data are needed for PCB production?


PCB Gerber files with RS-274-X format.

4. What’s the typical process flow for multi-layer PCB?


Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.

5. How many types of surface finish ACCPCB can do?


O-the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.

6. What are the main factors which will affect the price of PCB?


Surface finish;

Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;


7. How to you make the impedance calculation?


The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment.



Contact Details
Accuracy Electronics Technologies Co.,Ltd

Contact Person: sales

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