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High Density Immersion Gold 2.0mm 4mil FR4 10 Layer PCB

High Density Immersion Gold 2.0mm 4mil FR4 10 Layer PCB

High Density Immersion Gold 2.0mm 4mil FR4 10 Layer PCB
High Density Immersion Gold 2.0mm 4mil FR4 10 Layer PCB
High Density Immersion Gold 2.0mm 4mil FR4 10 Layer PCB
Product Details:
Place of Origin: China
Brand Name: ACCPCB
Certification: ISO,SGS,TS16949
Model Number: S102134
Payment & Shipping Terms:
Minimum Order Quantity: 1 PCS
Price: Negotiable
Packaging Details: Vacuum packing
Delivery Time: 3-5days
Payment Terms: T/T ,Western Union,Paypal
Supply Ability: 50000SQ.M/Per Month
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Detailed Product Description
Material: FR4 Count: 10layer
Surface Finish: Immersion Gold Application: Router
Solder Mask: Blue,Green,black, Yellow Etc. Copper Thickness: 2oz All Layer
Min. Hole Size: 8 Mil/6 Mil Min. Line Spacing: 4mil
Min. Line Width: 4mil Service: Customized PCB
High Light:

FR4 10 Layer PCB

,

4mil 10 Layer PCB

,

10 Layer Immersion Gold PCB

High Density Immersion Gold 2.0mm 4mil FR4 10 Layer PCB

 

10Layer FR4 High Density PCB with Immersion Gold and 2.0mm board thickness

 

Production description :

this board is 10layer with 1oz copper thickness. it is used on  router device. PCB prototype,samll volum, middle and large volume are accepted. no MOQ request for new order. all of these boards are met UL,TS16949, ISO9001 Etc.

 

Key Specifications of high frequency board :

Production Types:

 Rigid PCB

Layer :

 10layer

Base Material :

 FR4  

Copper Thickness :

1 oz

Board Thickness :

 0.4mm

Min. Finish Hole Size :

 8 mil  (0.20mm)

Min. Line Width :

 4 mil

Min. Line Spacing :

 4 mil

Surface Finishing :

ENIG

Drilling hole tolerance:

+/-3 mil    (  0.075mm )

Min Outline tolerance :

+/-4 mil    (  0.10mm )

Working panel size :

 max:1200mmX600mm (47'' X24'')

Outline profile:

Punching, Routing , CNC routing + V-cut

Solder mask :

LPI Solder mask, Peelable mask

Solder Mask Color :

Blue, black,yellow, matte green

Certificate :

UL, CQC, TS16949, ISO14000, ROHS

Silkscreen color :

White

Twist and Bow :

 no more than 0.75 %

 

PCB Flow Chart.pdf

 

Products Application:

 

1, Security monitor: Moible phone, PDA, GPS, caramer monitor etc;

2, Telecom Communication :wireless LAN card, XDSL router,Servers, Optical Device,Hard Drive etc;

3, Consumer Electronics: TV, DVD,Digital Caramer, air conditoner, Refrigerator,set-top box etc;

4, Vehicle Electronices: Car etc;

5, Industrial controls: Medical device ,UPS equipment, Control device etc;

6, Military & Defense : Military Weapons etc;

 

High Density Immersion Gold 2.0mm 4mil FR4 10 Layer PCB 0

Technology Capability:

Item

Technical Parameters

Layers

1-28 Layers

Inner Layer Min Trace/Space

4/4 mil

Out Layer Min Trace,Space

4/4 mil

Inner Layer Max Copper

4 OZ

Out Layer Max Copper

4 OZ

Inner Layer Min Copper

1/3 oz

Out Layer Min Copper

1/3 oz

Min hole size

0.15 mm

Max.board thickness

6 mm

Min.board thickness

0.2mm

Max.board size

680*1200 mm

PTH Tolerance

+/-0.075mm

NPTH Tolerance

+/-0.05mm

Countersink Tolerance

+/-0.15mm

Board Thickness Tolerance

+/-10%

Min BGA

7mil

Min SMT

7*10 mil

Solder mask bridge

4 mil

Solder mask color

White,black,blue,green,yellow,red,etc

Legend color

White,black,yellow,gray,etc

Surface finish

HAL,OSP, Immersion Ni/Au ,Imm silver/SN,ENIG

Board materials

FR-4;high TG;HighCTI; halogen free; Aluminum Bsed PCB,high frequency(rogers,isola),copper -base PCB

Impedance control

+/-10%

Bow and twist

≤0.5
 

 

High Density Immersion Gold 2.0mm 4mil FR4 10 Layer PCB 1   

FAQ :

1. How do ACCPCB ensure quality?

  Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?

     Common FR4, high-TG and halogen-free boards, Rogers, Arlon,           Telfon, aluminum/copper-based boards, PI, etc.


3. What data are needed for PCB production?

    PCB Gerber files with RS-274-X format.


4. What’s the typical process flow for multi-layer PCB?

  Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


5. How many types of surface finish ACCPCB can do?

 the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.

 

 

 

 

 

 

Contact Details
Accuracy Electronics Technologies Co.,Ltd

Contact Person: sales

Tel: +8615889494185

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