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| Place of Origin: | China |
| Brand Name: | ACCPCB |
| Certification: | ISO, UL, SGS,TS16949 |
| Model Number: | P1113 |
| Minimum Order Quantity: | 1-5PCS |
|---|---|
| Price: | Negotiable |
| Packaging Details: | Vacuum packaging |
| Delivery Time: | 12-16days |
| Payment Terms: | L/C / T/T / Western Union / Paypal |
| Supply Ability: | 30,000SQ.M/PER MONTH |
| Material: | FR4TG150 | Layer: | 6L |
|---|---|---|---|
| Surface Finish: | HAL LEAD FREE | Thickness: | 1.60mm |
| Solder Mask: | Green | ||
| High Light: | double sided fr4 pcb,dual layer pcb |
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Lead Free HAL Impedance Control PCB 6 Layer FR4 TG170 Custom Irregular Shape
Key Specifications/Special Features :
| Base Material : | ITEQFR4 |
| Board Thickness : | 1.6mm |
| Layers : | 6 layers |
| Copper thickness : | 2 / 1 / 1 / 1 / 1 / 2 OZ |
| Surface Finish : | HAL LEAD FREE |
| Impedance : | 90Ohm |
| Min. Hole Size : | 0.20mm |
| Min. Line Width : | 0.1mm/4mil |
| Min. Line Spacing : | 4/4mil(0.1/0.1mm) |
| Capacity of Production : | 50000Sq.m/month |
PCB Flow Chart.pdf
Technology Cabality:
| Item | Technical Parameters |
| Layers | 1-28 Layers |
| Inner Layer Min Trace/Space | 4/4 mil |
| Out Layer Min Trace,Space | 4/4 mil |
| Inner Layer Max Copper | 4 OZ |
| Out Layer Max Copper | 4 OZ |
| Inner Layer Min Copper | 1/3 oz |
| Out Layer Min Copper | 1/3 oz |
| Min hole size | 0.15 mm |
| Max.board thickness | 6 mm |
| Min.board thickness | 0.2mm |
| Max.board size | 680*1200 mm |
| PTH Tolerance | +/-0.075mm |
| NPTH Tolerance | +/-0.05mm |
| Countersink Tolerance | +/-0.15mm |
| Board Thickness Tolerance | +/-10% |
| Min BGA | 7mil |
| Min SMT | 7*10 mil |
| Solder mask bridge | 4 mil |
| Solder mask color | White,black,blue,green,yellow,red,etc |
| Legend color | White,black,yellow,gray,etc |
| Surface finish | HAL,OSP, Immersion Ni/Au ,Imm silver/SN,ENIG |
| Board materials | FR-4;high TG;HighCTI; halogen free; Aluminum Bsed PCB,high frequency(rogers,isola),copper -base PCB |
| Impedance control | +/-10% |
| Bow and twist | ≤0.5 |
Quality assurance :
Every production process has a special person to test to ensure quality, AOI, E-testing, Flying Probe Test.
Have professional engineers to check the quality
All products have passed CE, FCC, ROHS and other certifications
Application:
Widely used in stage, Industrila control,computer,consuming electronics,security,automotive,power electronics,medical,telecom etc.
Lead Time :
| Lead Time | 2 / L | 4 / L | 6 / L | 8 / L |
| Sample Order | 3-5days | 6-8days | 10-12days | 12-14days |
| Mass Production | 7-9days | 8-10days | 12-15days | 15-18days |
FAQ :
1. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
2. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
3. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.
4. How many types of surface finish ACCPCB can do?
the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.
5. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process
Contact Person: sales
Tel: +8615889494185
