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50 Ohm Impedance Control PCB Integrated Circuit Board 0.15 Mm Min Hole Size

50 Ohm Impedance Control PCB Integrated Circuit Board 0.15 Mm Min Hole Size

    • 50 Ohm Impedance Control PCB Integrated Circuit Board 0.15 Mm Min Hole Size
    • 50 Ohm Impedance Control PCB Integrated Circuit Board 0.15 Mm Min Hole Size
  • 50 Ohm Impedance Control PCB Integrated Circuit Board 0.15 Mm Min Hole Size

    Product Details:

    Place of Origin: China
    Brand Name: ACCPCB
    Certification: ISO, UL, SGS,TS16949
    Model Number: P1073

    Payment & Shipping Terms:

    Minimum Order Quantity: 1-5PCS
    Price: Negotiable
    Packaging Details: Vacuum packaging
    Delivery Time: 12-16days
    Payment Terms: L/C / T/T / Western Union / Paypal
    Supply Ability: 50000SQ.M/PER MONTH
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    Detailed Product Description
    Material: FR4 Layer: 12L
    Surface Finish: Immersion Silver Thickness: 1.0mm
    Board Thickness: 0.2-3.0mm Min. Hole Size: 0.15mm
    Solder Mask: Blue
    High Light:

    custom printed circuit board

    ,

    dual layer pcb

    50 Ohm Impedance Control PCB Integrated Circuit Board 0.15 Mm Min Hole Size

     

    Key Specifications/Special Features :

     

    Base Material : Nanya FR4
    Board Thickness : 1.60 mm
    Layers : 12 layers
    Copper thickness : 1 OZ in all layer
    Surface Finish : ENIG
    Impedance : 50Ohm
    Min. Hole Size : 0.15 mm
    Min. Line Width : 0.1mm/4mil
    Min. Line Spacing : 4/4mil(0.1/0.1mm)
    Capacity of Production : 50000Sq.m/month

     

    Advantages:


    • Strict product liability, taking IPC-A-160 standard
    • Engineering pretreatment before production
    • Production process control (5Ms)
    • 100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
    • 100% AOI inspection, including X-ray, 3D microscope and ICT
    • High-voltage test, impedance control test
    • Micro section, soldering capacity, thermal stress test, shocking test
    • In-house PCB production
    • No minimum order quantity and free sample
    • Focus on low to medium volume production
    • Quick and on-time delivery

     

    Quality assurance :

     

    Every production process has a special person to test to ensure quality, AOI, E-testing, Flying Probe Test.
    Have professional engineers to check the quality
    All products have passed CE, FCC, ROHS and other certifications

     

    Application:


    Widely used in stage, Industrila control,computer,consuming electronics,security,automotive,power electronics,medical,telecom etc.

     

    Lead Time : 

     

    Lead Time 2 / L 4 / L 6 / L 8 / L
    Sample Order 3-5days 6-8days 10-12days 12-14days
    Mass Production 7-9days 8-10days 12-15days 15-18days
     

     

     

     

    FAQ :

     

    1. How do ACCPCB ensure quality?

     

    Our high quality standard is achieved with the following.

     

    1.1 The process is strictly controlled under ISO 9001:2008 standards.
    1.2 Extensive use of software in managing the production process
    1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
    1.4.Dedicated quality assurance team with failure case analysis process

    2. What kinds of boards can ACCPCB process?

     

    Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


    3. What data are needed for PCB production?

     

    PCB Gerber files with RS-274-X format.


    4. What’s the typical process flow for multi-layer PCB?

     

    Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


    5. How many types of surface finish ACCPCB can do?

     

    O-the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.


    6. What are the main factors which will affect the price of PCB?

     

    Material;
    Surface finish;

    Board thickness, Copper thickness;
    Technology difficulty;
    Different quality criteria;
    PCB characteristics;
    Payment terms;

     

    7. How to you make the impedance calculation?

     

    The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment.

     

     

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    Contact Details
    Accuracy Electronics Technologies Co.,Ltd

    Contact Person: sales

    Send your inquiry directly to us (0 / 3000)