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Impedance Control PCB OEM Service Fully Inspected ROHS Comply multilayer pcb manufacturing

Impedance Control PCB OEM Service Fully Inspected ROHS Comply multilayer pcb manufacturing

Impedance Control PCB OEM Service Fully Inspected ROHS Comply multilayer pcb manufacturing
Impedance Control PCB OEM Service Fully Inspected ROHS Comply multilayer pcb manufacturing
Impedance Control PCB OEM Service Fully Inspected ROHS Comply multilayer pcb manufacturing
Product Details:
Place of Origin: China
Brand Name: ACCPCB
Certification: ISO, UL, SGS,TS16949
Model Number: P1086
Payment & Shipping Terms:
Minimum Order Quantity: 1-5PCS
Price: Negotiable
Packaging Details: Vacuum packaging
Delivery Time: 12-16days
Payment Terms: L/C / T/T / Western Union / Paypal
Supply Ability: 30,000SQ.M/PER MONTH
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Detailed Product Description
Material: KBFR4 Pcb: Customized PCB Factory
Product Name: 100ohm Impedance Controlled PCB Min. Hole Size: 0.2mm
Surface Finishing: LEAD FREE HAL Copper Thickness: 0.5 OZ--2.0OZ
High Light:

double sided fr4 pcb

,

dual layer pcb

Impedance Control PCB OEM Service Fully Inspected ROHS Comply multilayer pcb manufacturing
 
Key Specifications/Special Features :

Base Material :FR4TG180
Board Thickness :0.8 mm
Layers :2-20 layers
Copper thickness :2 OZ In all layer
Surface Finish :ENIG
Tolerance :+/-0.01mm
Impedance :100Ohm
Min. Hole Size :0.20mm
Min. Line Width :0.1mm/4mil
Min. Line Spacing :4/4mil(0.1/0.1mm)
Capacity of Production :50000Sq.m/month
Certificate:Certificate:
Company type:Manufacturer/ Factory

 
Quality assurance :
Every production process has a special person to test to ensure quality, AOI, E-testing, Flying Probe Test.
Have professional engineers to check the quality
All products have passed CE, FCC, ROHS and other certifications
 
Technology Capability:

ItemTechnical Parameters
Layers1-28 Layers
Inner Layer Min Trace/Space4/4 mil
Out Layer Min Trace,Space4/4 mil
Inner Layer Max Copper4 OZ
Out Layer Max Copper4 OZ
Inner Layer Min Copper1/3 oz
Out Layer Min Copper1/3 oz
Min hole size0.15 mm
Max.board thickness6 mm
Min.board thickness0.2mm
Max.board size680*1200 mm
PTH Tolerance+/-0.075mm
NPTH Tolerance+/-0.05mm
Countersink Tolerance+/-0.15mm
Board Thickness Tolerance+/-10%
Min BGA7mil
Min SMT7*10 mil
Solder mask bridge4 mil
Solder mask colorWhite,black,blue,green,yellow,red,etc
Legend colorWhite,black,yellow,gray,etc
Surface finishHAL,OSP, Immersion Ni/Au ,Imm silver/SN,ENIG
Board materialsFR-4;high TG;HighCTI; halogen free; Aluminum Bsed PCB,high frequency(rogers,isola),copper -base PCB
Impedance control+/-10%
Bow and twist≤0.5

 
Application:
Widely used in stage, Industrila control,computer,consuming electronics,security,automotive,power electronics,medical,telecom etc.
 
Lead Time : 

Lead Time2 /L4 /L6/ L8/ L
Sample Order3-5days6-8days10-12days12-14days
Mass Production7-9days8-10days12-15days15-18days
 

FAQ :
1. How do ACCPCB ensure quality?
  Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process
2. What kinds of boards can ACCPCB process?
   Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
3. What data are needed for PCB production?
   PCB Gerber files with RS-274-X format.
4. What’s the typical process flow for multi-layer PCB?
   Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.
5. How many types of surface finish ACCPCB can do?
    the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.
6. What are the main factors which will affect the price of PCB?
Material;
Surface finish;
Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;
 
 
 
            Impedance Control PCB OEM Service Fully Inspected ROHS Comply multilayer pcb manufacturing 0

Contact Details
Accuracy Electronics Technologies Co.,Ltd

Contact Person: sales

Tel: +8615889494185

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